本研究成功地發展加熱輔助超音波奈米轉印技術，藉由加熱輔助方式解決超音波奈米轉印技術上，超音波振動產生之熱源無法即時傳遞之問題。因為超音波施加的時間非常短暫，而且超音波振動產生的熱影響區域過於集中，加熱輔助可以提昇轉印機材本身之初始溫度，避免短暫時間超音波振動的加熱能量不足，亦可以降低壓印力量並且使轉印光阻完全填滿模仁凹穴中。
此外，本研究利用田口法的原理針對轉印品質與轉印後表面平均粗糙度進行品質分析。所設計控制因子為加熱盤設定溫度、等待加熱時間、第二段轉印力量及等待脫模時間，搭配L9直交表進行實驗，得到最佳水準組合為加熱盤設定溫度40 ℃、等待加熱時間1分鐘、轉印力量110 kgf和等待脫模時間3分鐘。利用原子力學顯微鏡量測剖面圖並計算PET材料填入矽模仁凹穴填滿率為96.40%，此結果與田口法計算預期結果相吻合，其誤差百分比為1.58%，轉印後圖案之表面平均粗糙度為6.27 nm。

關鍵字：超音波奈米轉印技術、加熱輔助、田口法

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