研究生: |
張捷茵 Jeh-Yin Chang |
---|---|
論文名稱: |
結合X光繞射與光學曲率技術量測薄膜材料之彈性係數 Measuring Elastic Constants of Thin Films by Combining X-ray Diffraction and Laser Curvature Techniques |
指導教授: |
黃嘉宏
Jia-Hong Huang 喻冀平 Ge-Ping Yu |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
原子科學院 - 工程與系統科學系 Department of Engineering and System Science |
論文出版年: | 2008 |
畢業學年度: | 96 |
語文別: | 英文 |
論文頁數: | 102 |
中文關鍵詞: | 彈性係數 、楊氏系數 、浦松比 |
外文關鍵詞: | elastic constant, Young's modulus, Poisson's ratio |
相關次數: | 點閱:1 下載:0 |
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In this study, we have proposed a non-destructive method to simultaneously determine the Young’s modulus (E) and Poisson’s ratio (ν) of polycrystalline thin film materials. The method involved independent stress measurement by laser curvature technique and strain components determination by sin2□ X-ray diffraction (XRD) method, and afterward, elasticity theory was employed to calculate E and ν. The proposed method has several advantages including (1) Both XRD and optical curvature techniques are non-destructive; (2) Both measurements are well-developed techniques supported by established theoretical bases and therefore good reliability can be expected in the measurement. The accuracy of the obtained values of E and ν were further verified. The cos2αsin2□ method, associated with asymmetrical grazing incident X-ray geometry, was performed on the same film and the previously determined E and ν were used to calculate the stress which was compared with that from optical curvature method. Sine sin2y method and cos2αsin2y method explore distinct groups of crystals lying in different depth of the film, the diffraction information of these two methods does not extract from identical diffraction planes. Provided the two stress values are close enough to be within the measurement error, the accuracy of the measured E and ν can be confirmed. Furthermore, if the elastic constants of the film can be precisely determined, the depth profile of residual stress can be assessed using cos2αsin2y method by appropriately adjusting the incident angle. The experimental results also demonstrated that the elastic constants in two TiN films may have significant difference. This may be due to the variation in compositions and film structure, which results in different interatomic force and thus divergent E values. In addition, one should be cautious when employing the NIP-determined E in sin2y or cos2αsin2y method to calculate the residual stress because the modulus may not give correct stress value all the time. However, the trend of the residual stress may not be significantly affected due to the uncertainty in E value.
[1] D. Schneider and T. Schwarz, Surf. Coat. Technol., 91 (1997) 136-146.
[2] P. Djemia, C. Dugautier, T. Chauveau, E. Dogheche, M. I. De Barros and L. Vandenbulcke, J. Appl. Phys., 90, 8 (1993) 3771-3779.
[3] S. L. Zhang and J. C. M. Li, J. Polym. Sci. Part B: Polym Phys 42: (2004) 260-266.
[4] A. G. Every, Meas. Sci. Technol., 13 (2002) R21-R39.
[5] W. N. Sharpe Jr., B. Yuan and R. L. Edwards, J. Microelectromech. Syst., 6, 3 (1997) 193-199.
[6] Sharpe Jr, W. N., Opt. Engng, 21 (1982) 483.
[7] J. A. Ruud, D. Josell and E. Spaepen, J. Mater. Res., 8 (1993) 112-117.
[8] A. Kretschmann, W. M. Kuschke, S. P. Baker and E. Arzt, J. Mater. Res., 463 (1997) 59.
[9] D. T. Read, Y.-W. Cheng, R. R. Keller and J. D. McColskey, Scrip. Mater., 45 (2001) 583-589.
[10] I. Chasiotis and W. G. Knauss, Experimental Mechanics, 42 (2002) 51-57.
[11] Yoshitada Isono, Member, IEEE, Takahiro Namazu and Nobuyuki Terayama, J. Microelectromech. Syst., 15, 1 (2006) 169-180.
[12] H. Ogawa, K. Suzuki, S. Kaneko, Y. Nakano, Y. Ishikawa, and T. Kitahara, Proc. Tenth IEEE Int. Conf. J. Microelectromech. Syst., 1997, p.430.
[13] R. D. Emery and G. L. Povirk, Acta Mater., 51 (2003) 2067-2078.
[14] J. W. Beams, Proceedings of an International Conference, Sponsored by Air Force
Office of Scientific Research, Air Research and Development Command and The General Electric Research Laboratory, 59 (1959) 183-192.
[15] O. Tabata, K. Kahawata and S. Sugiyama, Sensors and Actuators, 20 (1989) 135.
[16] J. J. Vlassak and W.D. Nix, J. Mater. Res., 7 (1992) 3242-3249.
[17] M. K. Small and W. D. Nix, J. Mater. Res., 7 (1992) 1553.
[18] B. J. Gally, C. C.Abnet, S. Brown and C. Chui, Thin Films--Stresses and Mechanical Properties VIII, MRS Symposium Proceedings, 594 (2001) 195-200.
[19] A. J. Kalkman, A. H. Verbruggen, G. C. A. M. Janssen and F. H. Groen, Rev. Sci. Instrum., 70, 10 (1999) 4026-4031.
[20] A. J. Kalkman, A. H. Verbruggen and G. C. A. M. Janssen, Rev. Sci. Instrum., 74, 3 (2003) 1383-1385.
[21] C. K. Huang, W. M. Lou, C. J. Tsai, T.-C. Wu and H.-Y. Lin, Thin Solid Films, 515 (2007) 7222-7226.
[22] X. Wei, D. Lee, S. Shim, X. Chena and J. W. Kysar, Scrip. Mater., 57 (2007) 541-544.
[23] A. Karimi, O. R. Shojaei, T. Kruml and J. L. Martin, Thin Solid Films, 308/309 (1997) 334-339.
[24] J. S. Mitchell, C. A. Zorman, T. Kicher, S. Roy and M. Mehregany, J. Aerospace Engineering, 16 (2003) 46-54.
[25] G. G. Stoney, Proc. R. Soc. Lond., A82 (1909) 172.
[26] A. Witvrouw, Ph.D. thesis, Harvard University, 1992.
[27] A. Witvrouw and F. Spaepen, Mater. Res. Soc. Symp. Proc., 188 (1990) 147.
[28] A. Witvrouw, P. Campos and F. Spaepen, Mater. Res. Soc. Symp. Proc., 239 (1992) 121.
[29] A. Witvrouwa and F. Spaepen, J. Appl. Phys., 73, 11 (1993) 7344-7350.
[30] J.-H. Zhao, T. Ryan, P. S. Ho, A. J. McKerrow and W.-Y. Shih, J. Appl. Phys., 85, 9 (1999) 6421-6424.
[31] J.-H. Zhao, Y. Du, M. Morgen and P. S. Ho, J. Appl. Phys., 87, 3 (2000) 1575-1577.
[32] J.-H. Zhao, T. Ryan, P. S. Ho, A. J. McKerrow and W.-Y. Shih, J. Appl. Phys., 88, 5 (2000) 3029-3038.
[33] A. Guha, Bending strength tests (ASTM E 855), in: ASM Handbook, vol. 8: Mechanical Testing and Evaluation, ASM International, Materials Park, Ohio, USA, 2000, pp. 175-180.
[34] J. S. St□lken and A. G. Evans, Acta Mater., 46, 14 (1998) 5109-5115.
[35] O. Kraft, O. R. Schwaiger and W. D. Nix, Mater. Res. Soc. Symp. Proc., 518 (1998) 39.
[36] J. Florando, H. Fujimoto, Q. Ma, O. Kraft, R. Schwaiger and W. D. Nix, Mater. Res. Soc. Symp. Proc., 563 (1999) 231.
[37] C. J. Drummond and T. J. Senden, Materials Science Forum, 189 (1995) 107-113.
[38] H.-C. Tsai and W. Fang, Sensors and Actuators, A103 (2003) 377-383.
[39] M. Hoffmann and R. Birringer, Mater. Sci. Eng., A202 (1995) 18-25.
[40] Cheng Luo, T. W. Schneider, R. C. White, J. Currie and Makarand Paranjape, J. Micromech. Microeng., 13 (2003) 129-133.
[41] X. Jin, C. O. Kim, Y. P. Lee, Y. Zhou and H. Xu, Appl. Phys. Lett., 79, 5 (2001) 650-652.
[42] Yasuo Tomioka and Norio Yuki, J. Mater. Proc. Technol., 146 (2004) 228-233.
[43] J. D. Maynard, J. Acoust. Soc. Am., 91 (1992) 1754.
[44] J. D. Maynard, Phys. Today, 49, 1 (1996) 26-31.
[45] A. Migliori and J. D. Maynard, Rev. Sci. Instrum., 76 (2005) 121301.
[46] A. Migliori and T. W. Darling, Ultrasonics, 34 (1996) 473-476.
[47] J. H. So, J. R. Gladden, Y. F. Hu, J. D. Maynard and Q. Li, Phys. Rev. Lett., 90, 3 (2003) 036103.
[48] K. A. Pestka II, J. D. Maynard, D. Gao and C. Carraro, Phys. Rev. Lett., 100 (2008) 055503.
[49] C. Liang and B. C. Prorok, J. Micromech. Microeng., 17 (2007) 709-716.
[50] C.-H. Ma, J.-H. Huang and Haydn Chen, Surf. Coat. Technol., 200 (2006) 3868-3875.
[51] Hertz H. On the contact of elastic solids. J. Reine. Angew. Math., 92 (1881) 156-71. Translated and reprinted in English. In: Hertz's miscellaneous papers. London: Macmillan & Co., 1896 [Chapter 5].
[52] Hertz H. On hardness. Verh Ver BefoK rderung Gewerbe Fleisses, 61 (1881) 410. Translated and reprinted in English. In: Hertz's miscellaneous papers. London: Macmillan and Co., 1896 [Chapter 6].
[53] A. C. Fischer-Cripps, Vacuum, 58 (2000) 569-585.
[54] A. C. Fischer-Cripps, Surf. Coat. Technol., 200 (2006) 4153-4165.
[55] C. M. Cheng and Y. T. Cheng, J. Mater. Res., 13(4) (1998) 1059.
[56] K.W. McElhaney, J. J. Vlassak and W. D. Nix, J. Mater. Res., 13(5) (1998) 1300.
[57] A. Bolshavok and G. M. Pharr, J. Mater. Res., 13(4) (1998) 1049.
[58] W. D. Nix, Mater. Sci. Eng., A 234 (1997) 37.
[59] R. Saha and W. D. Nix, Acta. Mater., 50 (2002) 23-38.
[60] W. C. Oliver and G. M. Pharr, J. Mater. Res., 19 (2003) 3.
[61] Y. Wei, X. Wang and M. Zhao, J. Mater. Res., 19 (2004) 208.
[62] H. Huang, K. Winchester, Y. Liu, X. Z. Hu, C. A. Musca, J. M. Dell and L. Faraone, J. Micromech. Microeng., 15 (2005) 608-614.
[63] F. Richter, M. Herrmann, F. Molnar, T. Chudoba, N. Schwarzer, M. Keunecke, K.
Bewilogua, X. W. Zhang, H.-G. Boyen and P. Ziemann, Surf. Coat. Technol., 201 (2006) 3577-3587.
[64] A. A. Pelegri and X. Huang, Composites Sci. Technol., 68 (2008) 147-155.
[65] M. Chinmulgund, R. B. Inturi and J. A. Barnard, Thin Solid Films, 270 (1995) 260-263.
[66] H. Huang and F. Spaepen, Acta Mater., 48 (2000) 3261-3269.
[67] Z. M. Zhou, Y. Zhou, C. S. Yang, J. A. Chen, W. Ding and G. F. Ding, Sensors and Actuators, A 127 (2006) 392-397.
[68] F. Badawi and P. Villain, J. Appl. Cryst., 36 (2003) 869-879.
[69] G. Cornella, S.-H. Lee, W. D. Nix and J. C. Bravman, Appl. Phys. Lett., 71, 20 (1997) 2949-2951.
[70] P. F. Fewster and N. L. Andrew, J. Appl. Crystallogr., 28 (1995) 451.
[71] P.-O. Renault, K. F. Badawi, L. Bimbault, Ph. Goudeau, E. Elka□m and J. P. Lauriat, Appl. Phys. Lett., 73, 14 (1998) 1952-1954.
[72] P.-O. Renault, K. F. Badawi, P. Goudeau and L. Bimbault, Eur. Phys. J. Appl. Phys., 10 (2000) 91-96.
[73] K. F. Badawi, P. Villain, Ph. Goudeau and P.-O. Renault (2002). Appl. Phys. Lett., 80, 25 (2002) 4705-4707.
[74] P. Villain, P. Goudeau, P.-O. Renault and K. F. Badawi, Adv. Eng. Mater., 4, 8 (2002) 554-557.
[75] P. Villain, P.-O. Renault, Ph. Goudeau and K. F. Badawi, Thin Solid Films, 406 (2002) 185-189.
[76] J. F. Jongste, O. B. Loopstra, G. C. A. M. Janssen and S. Radelaar, J. Appl. Phys., 73, 6 (1993) 2816-2820.
[77] U. Laudahn, S. F□hler, H. U. Krebs, A. Pundt, M. Bicker, U. v. H□lsen, U. Geyer and R. Kirchheim, Appl. Phys. Lett., 74, 5 (1999) 647-649.
[78] M. A. Moram, Z. H. Barber and C. J. Humphreys, J. Appl. Phys., 102 (2007) 023505.
[79] Y. H. Yu, M. O. Lai, L. Lu and G. Y. Zheng, Surf. Coat. Technol., 200 (2006) 4006-4010.
[80] H.-Y. Chen, J.-H. Chen, F.-H. Lu, Thin Solid Films, 516 (2007) 345-348.
[81] Y. H. Yu, M. O. Lai and L. Lu, Smart Mater. Struct., 16 (2007) 487-492.
[82] C.-H. Ma, J.-H. Huang, Haydn Chen, Thin Solid Films, 418 (2002) 73-78.
[83] E. Macherauch and P. M□ller, Z. Angew. Phys., 13 (1961) 305-312.
[84] H. D□lle and V. Hauk, Z. f. Metalkde, 68 (1977) 728.
[85] P. Scherrer, Gott. Nachr., 2 (1918) 98.
[86] Leonid V. Azaroff and Martin J. Buerger, “The Powder Method in X-Ray Crystallography”, McGraw-Hill, New York (1958), p.233
[87] The RUMP and Genplot (version 3.53.346.0) software of Computer Graphic Service, Ltd.
[88] K. Fukutomi and M. Okada, Kinzoku Htomen Gijutsu, 35 (1984) 45.
[89] L. R. Doolittle, Nucl. Instr. and Meth., B9 (1985) 344-351.
[90] S. M. Sez, VLSI Technology, AT&T Bell Lab. Murry Hill, New Jersey, 1983 p.184
[91] W. C. Oliver, G. M. Pharr, J. Mater. Res., 7(6) (1992) 1564.
[92] W. A. Brantley, J. Appl. Phys., 44, 534 (1973).
[93] Wenwu Zhang, Y. Lawrence Yao, I. C. Noyan, J. Manuf, Sci. Eng., 126 (2004) 10-17.
[94] A. J. Perry, J. A. Sue and P. J. Martin, Surf. Coat. Technol., 81 (1996) 17-28.
[95] D Burgreen, Elements of Thermal Stress Analysis, C.P. Press, New York, 1971, p.462.
[96] Tecvac UK - Heat Treatment and Hard Coating Service (Wallwork Heat Treatment, hard coatings and surface engineering)
http://www.tecvac.co.uk/coatings01.php
[97] The Physics Hypertextbook (1998-2008 by Glenn Elert -- A Work in Progress)
http://hypertextbook.com/physics/thermal/expansion/
[98] A. J. Perry and L. Chollet, J. Vac. Sci. Technol., A 4(6) (1986) 2801.
[99] European report, FASTE MAT1-CT 940045, IWT, Bremen, Germany, 1998.
[100] A. S. Maxwell, S. Owen-Jones and N. M. Jennett, Rev. Sci. Instrum., 75, 4 (2004) 970-975.
[101] J. A. Sue, Surf. Coat. Technol., 54/55 (1992) 154-159.
[102] H. Ljungcrantz, M. Od□n, L. Hultman, J. E. Greene and J.-E. Sundgren, J. Appl. Phys., 80, 12 (1996) 6725-6733.
[103] C. Ernsberger, A. J. Perry, L. P. Lehman, A. E. Miller, A. R. Pelton and B. W. Dabrowski, Surf. Coat. Technol., 36 (1988) 605-616.
[104] M. D. Tran, J. Poublan and J. H. Dautzenberg, Thin Solid Films, 308/309 (1997) 310-314.
[105] A. J. Perry, Thin Solid Films, 193/194 (1990) 463-471.
[106] A. J. Perry, V□clav Valvoda and David Rafaja, Thin Solid Films, 214 (1992) 169-174.
[107] J. Almer, U. Lienert, R. L. Peng, C. Schlauer and M. Od□n, J. Appl. Phys., 94, 1 (2003) 697-702.
[108] J. O. Kim, J. D. Achenbach, P. B. Mirkarimi, M. Shinn and S. A. Barnett, J. Appl. Phys., 72, 5 (1992) 1805-1811.
[109] E. T□r□k, A. J. Perry, L. Chollet and W. D. Sproul, Thin Solid Films, 153 (1987) 37-43.
[110] O. R. Shojaei and A. Karimi, Thin Solid Films, 332 (1998) 202-208.
[111] H. Ollendorf, D. Schneider, Th. Schwarz, G. Kirchhoff and A. Mucha, Surf. Coat. Technol., 84 (1996) 458-464.
[112] C. K. Huang, W. M. Lou, C. J. Tsai, T.-C. Wu and H.-Y. Lin, Thin Solid Films, 515 (2007) 7222-7226.
[113] A. Debelle, G. Abadias, A. Michel and C. Jaouen, Appl. Phys. Lett., 84, 24 (2004) 5034-5036.
[114] G. Maeder, Chem. Scr., A, 26, (1986) 23-31.
[115] I. C. Noyan, J. B. Cohen, Residual Stress, Measurement by Diffraction and Interpretation, Springer-Verlag, New York, 1987.