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研究生: 葉貞吟
Yeh, Jen-Yin
論文名稱: LED排列之最佳化設計
The Optimum Design of LED Arrangement
指導教授: 龔 正
Gong, J.
黃智方
Huang, Chih-Fang
口試委員:
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電子工程研究所
Institute of Electronics Engineering
論文出版年: 2009
畢業學年度: 97
語文別: 中文
論文頁數: 100
中文關鍵詞: 發光二極體光通量溫度敏感參數熱電耦合疊代相關色溫發光效率
外文關鍵詞: LED, luminous flux, TSP, thermal-electrical Coupling, iteration, correlated color temperature, luminous efficiency
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  • 本論文探討發光二極體在自然對流環境下全功率的操作情形,希望藉由不同的排列,使其接面溫度上升最少,對總體光通量的影響最小。如果可能,甚至可以在不損及額定規格的情形下減少LED使用的顆數,以達到節能、提高LED壽命、及降低成本的目的。研究方法是利用廠商放在網路的規格表,此規格表需包含3個重要的熱電光的參數及各色光LED光譜分佈圖,此3個參數分別是溫度敏感參數(TSP,代表熱電耦合關係的溫度參數), 溫度升高對光通量(流明)的衰退曲線圖,及溫度升高對主波長紅移的正比例係數,經熱電耦合疊代到收斂,即可得到其亮度的衰減與其顏色的變化(混光,用相關色溫來表示),希望藉由這套分析LED排列的方法,可以達到降低成本(減少LED個數),並且在維持一定的發光效率下減少光通量的衰減。由模擬與程式,可得到在這樣散熱相當困難的情形下,若將3W高功率LED由15顆減少為14顆,則LED成本少了6%~7%,但需要改變結構到能將間距拉大很多(0.5cm,1cm拉大到超過3cm,例如4.5cm,7cm,10cm)。並希望這個可找到熱源減少下限與其所搭配的間距之方法以後可以應用在更高瓦數或更小散熱面積的照明上。


    This thesis conferring LED that operates in full power and nature convection circumstance. By changing the different arrangements, we hope to improve its performance, less junction temperature increase and less influence on total luminous flux. If possible, we hope to decrease the number of LED, and still maintain its own regulation specifications, achieving the purpose of energy saving, extending its life and cost down.
    The method for analysis is using datasheet on internet which is supplied by LED manufacturers. The datasheet has to include three important parameters that relate to thermal, electrical, and optical properties, and its optical spectrum distribution diagram. The three parameters is TSP (it is a coefficient which stands for the relationship of thermal-electrical coupling), the decline curve illustration that describes the increase of temperature, and the decrease of luminous flux, and the directly proportional coefficient to the red shift of dominant wavelength when the temperature is increasing. After finishing thermal-electrical coupling iterations till convergence, one can get the reduction of luminous flux and the change of mixing color that represent by correlated color temperature
    Hoping this analysis method of LED arrangement will achieve the aim of cost down by decreasing the number of LED.
    With simulation and programming, we can obtain the result that under such difficult conditions, if we can decrease 3W LED from 15 to 14 by pulling up the lager distance of structure(for example: from 0.5cm, 1cm to more than 3cm, like 4.5cm,7cm, or 10cm). Also we hope this method which can find out the limit of number decreasing and the distance it should has would apply to illumination which owns more power or fewer heat dissipation area.

    中文摘要........................................ I Abstract........................................ II 致謝........................................ IV 目錄........................................ V 第一章 序論........................................ 1 1.1 研究動機........................................ 1 1.2論文概要........................................ 2 第二章 LED基本散熱與光學理論........................................ 3 2.1 熱傳方式........................................ 3 2.1.1 傳導........................................ 3 2.1.2 對流........................................ 4 2.1.3 輻射........................................ 5 2.2 熱阻簡介........................................ 6 2.3 LED溫升與順偏電壓遞減簡介........................................ 8 2.4光度學簡介........................................ 10 2.4.1 輻度學與光度學........................................ 10 2.4.2 CIE人眼視覺函數與流明........................................ 11 2.4.3 發光效率........................................ 12 2.5 色度學簡介........................................ 14 2.5.1 CIE1931-XYZ色度座標........................................ 14 2.5.2 LED混色........................................ 16 2.5.3色溫與相關色溫........................................ 17 2.6 LED封裝簡介........................................ 19 第三章低功率LED之散熱模擬........................................ 21 3.1 簡化模型........................................ 21 3.2 網格測試........................................ 24 3.3 改變LED個數與溫升的關係 ........................................26 3.4 不同個數的低功率LED改變距離觀察與溫升的關係........................................ 28 3.5 不同邊界條件與溫升的關係........................................ 30 3.6 綜合比較........................................ 35 第四章 高功率LED散熱模擬與發光效率之分析........................................ 37 4.1 流程圖簡介........................................ 37 4.2 LED規格表與曲線擬合(定電流350mA, 150mA)........................................ 41 4.2.1 LED光譜曲線擬合........................................ 44 4.3 簡化模型........................................ 48 4.4 網格測試........................................ 50 4.5 設計結........................................構說明 52 4.6變因分析........................................ 60 4.6.1 高功率LED個數改變對溫度與光通量影響........................................ 60 4.6.2 承載高功率LED板子厚度改變對溫度與光通量影響........................................ 64 4.6.3 高功率LED間距改變對溫度與光通量影響........................................ 69 4.6.4 相近間距下討論高功率LED間距改變對溫度與光通量影響 75........................................ 4.7 綜合比較........................................ 80 4.7.1 變因綜合比較........................................ 80 4.7.2 找出最佳設計........................................ 82 第五章 結論........................................ 91 5.1 結論與未來展望........................................ 91 參考文獻 ........................................93 附錄 ........................................97

    [1]sslconsult.net/LED_Lighting_Blog.aspx
    [2]Cree® XLamp® LED Thermal Management
    [3]LumiLEDS®LUXEON Thermal Design Guide, application brief AB05
    [4]Osram® Thermal Management of SMT LED Osram
    [5]Osram® Thermal Management of Golden Dragon LED
    [6]Nichia® Thermal Management design of LEDs
    [7]Avago® LED Lamp Thermal Properties, application brief A04
    [8]Thermal Considerations for ACOL LEDs and LED cluster devices, aCOL
    [9]http://en.wikipedia.org/wiki/Thermal_resistance_in_electronics
    [10]Schubert, E. Fred, Light-emitting diodes, Cambridge University Press, 2006
    [11]S. Chhajed, Y. Xi, T. Gessmann, J. Q. Xi, J. M. Shah, J. K. Kim, and E. F. Schubert, “Junction Temperature in Light-Emitting Diodes Assessed by Different Methods,” SPIE Proceedings, vol. 5739, pp. 16-24, Mar. 2005.
    [12]Chao-Sheng Dong, “A Method for Dynamical Control of Color in Multi-Chip LED Module”, NTHU,2007。
    [13]L.Jayasinghe, Y.Gu,N.Narendran, ”Characterization of Thermal Resistance Coefficient of High-power LEDs”, Proceedings of SPIE-The International Society for Optical Engineering,v6337,2006.
    [14]PALMER, J. M. 2003, “Radiometry and photometry FAQ”
    [15]http://cvision.ucsd.edu/cie.htm
    [16]Zhi-Xin Huang, "The design of small color-mixing elements of RGB LEDs", NCCU, 2004
    [17]Ohta, Noboru, Colorimetry fundamentals and applications, Chichester, West Sussex, England; Hoboken, NJ, USA : J. Wiley, c2005.
    [18]http://cck0217.myweb.hinet.net/LIGHTCOLOR.html
    [19]C. S. McCamy, “Correlated color temperature as an explicit function of chromaticity coordinates”, Color Res. Appl. 17,142–144(1992)
    [20]Javier Hernandez-Andre´ s, Raymond L. Lee, Jr., and Javier Romero,” Calculating correlated color temperatures across the entire gamut of daylight and skylight chromaticities”
    [21]Philips Luxeon LED. Lumen Maintenance of White LUXEONR Power Light Sources, Application Brief AB07
    [22]Oon Siang Ling, "Thermally Efficient Technique for High-Power LED Packages", Nikkei Electronics Asia, July 2008 http://techon.nikkeibp.co.jp/article/HONSHI/20080627/153991/?P=3
    [23]陳明祥(Ming-Xiang Chen); 馬澤濤(Ze-Tao Ma);劉勝
    (Sheng Liu), "Research on Localized Induction Heating for LED Packaging", 發光學報,28卷2期(2007/04),pp241-245
    [24]http://www.xlresin.com/Article/18879_3.html
    [25]Yi-Liang Huang, "Thermal Analysis and Optimization of Light-Emitting Diodes Packaging", NTHU, 2005.
    [26]N. A. A. Karim, P. A. A. Narayana and K. N. Seetharamu, “Thermal analysis of LED package ”, Microelectronics International, Vol. 23, pp. 19-25, 2006
    [27]Treurniet, T. Lammens, V, "Thermal management in color variable multi-chip led modules", 22nd IEEE SEMI-THERM Symposium, 2006.
    [28]洪崇智,張永農,顏義和,童世欽,謝宗城,"RGB LED 背光模組自動混光研究", 第七屆台灣電力電子研討會,台南,9月5日,2008.
    [29]顏豪呈,許文謙,何家銘,蔡長儒, "LED之IsSpice等效模擬模型", 第七屆台灣電力電子研討會,台南,9月5日,2008.
    [30]鄭健隆林建宏,陳柏力,陳冠文,"高功率LED之晶片溫度分析",第七屆台灣電力電子研討會,台南,9月5日,2008.
    [31]"USABLE LIGHT - Talking about real life lumen values", future electronics Design Notes, future technology magazine.
    [32]Icepak 4.4 User's Guide 2007
    [33]Icepak 4.4 Tutorial Guide 2007
    [34] http://www.bonbini.net/dossiers_techniques/led/eclairage_
    interieur/temperature_de_couleur_et_couleur_de_la_lumiere_blanche..._art31.html
    [35]MathWorks, MATLAB 7.0, (2004)
    [36]張智星,”MATLAB程式設計 入門篇”,清蔚科技,2004
    [37]張智星,” MATLAB 程式設計 進階篇”,鈦思科技,2008
    [38]ProLight Opto Technology, "3 W Star RGB Full Color LED Standard", Technical Datasheet, Version: 2.7.2008.
    [39]ProLight Opto Technology, "1 W Star RGB Full Color LED Standard", Technical Datasheet, Version: 2.8.2008.
    [40]Regina Mueller-Mach and Gerd 0. Mueller, "White light emitting diodes for illumination", Proceedings of SPIE Vol. 3938 (2000)
    [41]史光國,半導體發光二極體及固體照明,全華, 2005.
    [42]García-Botella, Angel;Alvarez Fernández-Balbuena, Antonio; Vázquez-Moliní, Daniel; Bernabeu, Eusebio, “Thermal influences on optical properties of light-emitting diodes: a semiempirical model”, APPLIED OPTICS, Vol. 40, No. 4, 2001
    [43]Y.-L. Li, J. M. Shah, P. H. Leung, Th. Gessmann and E. F. Schubert, “Performance characteristics of white light sources consisting of multiple light-emitting diodes”, Proc. of SPIE, Vol. 5187, p.178-184, 2004
    [44]Yoshi Ohno, “Color Rendering and Luminous Efficacy of White LED Spectra”, Proc. of SPIE, Vol. 5530, p.88-98, 2004
    [45]Kwong Man and Ian Ashdown, “Accurate Colorimetric Feedback for RGB LED Clusters”, Proc. of SPIE, Vol.6337, 2006
    [46]Yi-Shian Shiu, “Integrated Numerical and Experimental Study on the Thermal Management for a Motorcycle LED Headlamp”, NTUST, 2008
    [47]http://www.ttic-tech.com.tw/02_35.htm
    [48]http://www.brightbeam.com.tw/modules/myAds/index.php?pa=
    viewannonces&lid=496&photo1=1189658189_12.jpg&photo2=1189658189_13.jpg&photo3=&uid=1600
    [49]http://mouein.pixnet.net/blog/post/22962608
    [50]http://www.fuji.com.tw/dscacc.asp?AID=6629

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