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| 研究生： |
范嘉偉 Chia-Wei Fan |
|---|---|
| 論文名稱： |
無鉛/錫鉛銲點之金屬間化合物成長機制及潛變特性 Growth Mechanism of Intermetallic Compound and Creep Behavior of Lead-free/Lead-containing Solder Joints |
| 指導教授： |
葉銘泉博士
Dr. Ming-Chuen Yip |
| 口試委員: | |
| 學位類別： |
碩士 Master |
| 系所名稱： |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
| 論文出版年： | 2004 |
| 畢業學年度： | 92 |
| 語文別： | 中文 |
| 論文頁數： | 173 |
| 中文關鍵詞： | 金屬間化合物 、擴散係數 、剪力推球強度 、破壞模式 、穩態潛變率 |
| 外文關鍵詞： | intermetallic compound, diffusion coefficient, ball shear strength, failure mode, steady-state creep rate |
| 相關次數： | 點閱：105 下載：0 |
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本文的研究範圍著重在IMC實驗及潛變實驗。IMC實驗主要為探討63Sn-37Pb、Sn-3.5Ag和Sn-4Ag-0.5Cu三種錫球迴焊至Au/Ni/Cu表面處理的銲墊後，銲點界面IMC層的成長狀況。除了將量測銲點經等溫時效作用後界面IMC層的成長厚度外，也將對銲點的剪力強度進行測試。藉由IMC的厚度量測來探討IMC的成長機制、擴散係數以及生成時所需克服的致動能，而銲點經剪力推球測試的結果則可做為評估銲點強度的參考，並再由銲點破壞模式分析更進一步了解銲點的破壞機制，最後針對IMC、剪力強度和破壞模式三者間的關係做深入探討。
無鉛銲點的靜態與潛變實驗主要探討Sn-3.5Ag及Sn-4Ag-0.5Cu二種銲點的靜態行為及潛變特性。靜態實驗包括比較銲點在25℃、75℃、125℃、150℃四個溫度下的靜態強度，並探討可能的變形機制，最後將負載及位移再換算成應力與應變，且藉由曲線嵌合得到近似的數值模型以便做為將來評估銲點強度的基準。潛變實驗則藉由靜態實驗求得的靜態強度做為選取應力等級時的參考，也是在25℃、75℃、125℃、150℃四個溫度下進行。潛變實驗的目的在於探討無鉛銲點在高溫時的塑性變形行為，並由實驗求得的應力指數及致動能來輔助了解銲點的潛變機制。使用的潛變模型共包括Arrhenius Power law、Dorn方程式及雙曲線正弦應力函數。
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