本論文將經過溼式化學清洗過(去除原生氧化層)之矽晶圓表面濺鍍鉑金屬層，經過表面清洗及表面改質，直接接合與施壓退火，接合後晶圓對探討接合之強度、電性以及接合界面性質。
將已鍍製鉑金屬層之晶圓，經過不同溼式化學清洗，觀測表面親、疏水性質。加入紫外線臭氧清洗機對鉑晶層表面做改質，並觀察表面親、疏水性質的改變，尋求有關鉑金屬層表面清洗及改質之製程。
本實驗分為兩個部分，其一於單一矽晶圓表面鍍上鉑金屬層，經過濕式化學表面清洗及紫外線臭氧清洗機表面改質後，與未鍍上金屬層並經化學表面清洗之另一矽晶圓直接接合，於不同氣氛、溫度下做退火處理。探討晶圓對接合後之強度、電性、接合界面之性質變化。
其二，將兩片矽晶圓皆濺鍍上鉑金屬層，經濕式化學表面清洗以及紫外線臭氧清洗機表面改質後，直接接合，於不同氣氛、溫度、時間下退火處理。比較與討論接合界面性質之變化。

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