半導體產業發展至今已超過60年，初期多由傳統的晶圓垂直整合製造企業（IDM-Integrated Device Manufacture）所領導，諸如英特爾、三星和意法半導體等大廠，上述大公司皆採用自身上下游垂直整合製造的優勢，從IC設計、晶圓生產、封裝測試、產品銷售等環節，統整並結合到一個集成流程中的商業模式。此法可以透過企業內部渠道優化製造流程，但龐大的成本支出也大大提高一般企業進入門檻。
也因半導體技術推演所導致的龐大資本支出，故在1986年後，台灣積體電路（TSMC）正式在台灣成立晶圓代工製造部，打破了有別過往的晶圓製造模式，也大幅降低了傳統IC晶片生產製造的門檻。也因台灣以台積電為首，輔以強大的IC設計及封裝產業分工明確、責無旁貸的文化驅使下，透過上下游完善的製造生態鏈，帶動了近二、三十年IC晶片製造產業的蓬勃發展，也因台灣實施晶片設計搭配晶圓代工的雙軌營運模式，迅速提升全球半導體技術和莫爾定律的推動。
正因為台系晶圓代工產業鏈趨於完善且頗具競爭力，傳統IDM企業大廠如英特爾及三星等美韓系大廠，逐漸地察覺了外部環境變革和自身的技術落後，勢必採用更全面的開發模式來突破自身的困境。但IC晶片開發並非一朝一夕可成，皆須透過內部製造整合過程和搭配產品的生命週期來採取對應的產能分配，包括供應鏈管理、生產管銷，引入相對應的新技術等，才能讓公司能夠更好地控制晶片設計開發、生產管理和成本控管，以期企業能夠建構完善的產品及制度，來實現企業獲利和永續經營的契機。
也因如此，本文旨在探討現今晶圓生產垂直整合製造設計開發和晶圓代工等分流外包流程對應的產業分析，以及該策略對於對傳統垂直整合商如英特爾等公司在未來企業發展方向的影響，並探討相關企業該如何能夠高效地利用創新模式去生產自身的產品，讓該企業能夠擬定持續性的競爭策略及優勢，並進一步突破當下營運僵局和未來市場的開創。

In retrospect, the semiconductor industry has been developing for more than 60 years, initially led by traditional IDM-Integrated Device Manufacturing industries, such as Intel, AMD, Samsung and STMicroelectronics, each of them has adopted their own integrated manufacturing advantages included but not limited to IC design, production, assembly test and unique business model. This best knowledge method could optimize the whole semiconductor manufacturing process through their internal channel, but the cost of capital expenditure also causes the extreme threshold of semiconductor enterprises.
For the reason, in 1986, Taiwan Semiconductor Manufacturing Company （TSMC） officially established a foundry service base company in Taiwan, breaking the Integrated Device Manufacturing industries mode in the past and greatly reducing the threshold of traditional production and manufacturing. Also, relevant IC design house, assembly and packaging industry with clear vertically-separated business mode of their responsibility and culture, through the upstream and downstream ecosystem chain, it has driven the vigorous development of IC design industry in the past several decades. Meanwhile, since Taiwan implements a dual-track operation system of IC design and foundry service, it quickly enhances global semiconductor technology and Moore’s law promotion gradually.
Also, there are comprehensive and competitive industry and foundry supply chain, traditional IDM corporates such as Intel and Samsung gradually realized the changes in the external environment and their own technological backwardness. It forces them to take more aggressive and comprehensive business development concept to break through their own predicament. But IC design and wafer producing is not a simple task, it must be consideration through whole manufacturing integration process and associated product life cycle then approaching corresponding capacity arrangement, including supply chain management, production control, and new technology introduction, etc., Once everything strengthens ready, the corporates could lead the better cost control. So, enterprises should consider building fantastic products and systems to achieve their profitability and sustainable opportunities.
Therefore, our article and case study aims to explore the change of current semiconductor industries and the impact on Intel business, and do the research to understand if there is any efficiently and innovative models for this company to use for its production, so that the company can create their own competitive strategies and integrated innovation, and overcome the existing operational bottleneck and marketing.

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