本研究開發新穎複合材料預期應用於高功率電晶體模組，材料的選擇會大幅影響其系統之可靠性、壽命以及安全性，電晶體係透過半導體製程技術由多層材料堆疊而成，然而，在高功率的運作之下傳統材料逐漸達到物理極限進而使得電晶體的壽命縮短且性能下降。因此，為了消除金屬層及基材之間的熱彈性係數之偏合(~300%)所造成之電晶體失效，本研究將針對高熱傳導係數以及低熱膨脹係數的要求來開發新型複合材料。本研究提出兩種方法來製造具備前述特性之新型複合材料，包括(i)將沈積過銅層的奈米碳管(CMT)添加到銅粉中形成Cu/CNT-Cu，(ii)將沈積過銅層的石墨烯添加至銅粉中形成Cu/Gr-Cu。
基於奈米碳管(CNT)本身的材料特性，本研究假設將沈積過銅層的奈米碳管添加到銅粉之中(即Cu/CNT-Cu)將具有高熱傳導係數以及低熱膨脹係數，這樣的特性使得本研究所提出之新型奈米複合材料超越了傳統材料。為實現此目標，本研究首先提高Cu/CNT-Cu的熱傳導係數至327 W/mK且在銅金屬注射成形的性能範圍內(320-340W/mK)，熱膨脹係數在此階段為6 ppm/K。為了更進一步改善其物理特性，本研究首次提出具有與純銅相近的熱傳導係數(390 W/mK)之Cu/Gr-Cu複合材料，此材料之熱傳導係數遠高於金屬注射成形的銅散熱片(320-340 W/mK)，同時也具有類矽材料之熱膨脹係數(~5 ppm/K)。前述之特性是透過調整注入參數來實現，透過調整注入參數不僅可以減少材料間的空隙，同時也能透過電鍍銅層在石墨烯上來增加介面之間的結合，即Gr-Cu。此優異的性質將Cu/Gr-Cu這種材料置至於Ashby圖的頂端，並且擁有較低的熱畸變係數以及出色的溫度穩定性。因此，這種材料因其高熱傳導係數以及低熱膨脹係數，故非常適合使用在高功率的模組應用，尤其是混和動力車和電動汽車。

The reliability, lifetime, and safety of power electric insulated gate bipolar transistor (IGBT) modules are a result of their progressive material selection, thereby necessitating the invention of new composite materials. High-end power modules are operated close to the maximum physical matching capability of their layered materials, leading to decreased lifetime and degraded performance, and thus creating demand for new composite materials with higher thermal conductivity and a lower coefficient of thermal expansion (CTE). To eliminate failures caused by the CTE mismatch (~300%) in the interface between metal and substrate material, two unique composite materials are proposed and evaulated in this thesis, including (i) the mixture of copper-coated CNT added to the copper powder (Cu/CNT-Cu) and (ii) the copper-coated graphene added to copper powder (Cu/Gr-Cu) to create nanocomposite materials.
Based upon the material properties of CNT, the Cu/CNT-Cu material is assumed to have a unique combination of high thermal conductivity and low coefficient of thermal expansion, which results in a new composite material that goes beyond the ability of conventional materials. To achieve this goal, the Cu/CNT-Cu composite with a significant improvement in thermal conductivity (~327 W/mK) which is within the industrial scale range of copper metal injection molding (320-340 W/mK) and low coefficient of thermal expansion (~6 ppm/K) have firstly eveloped. To further improve required physical property, this thesis reports for the first time Cu/Gr-Cu composite which exhibits similar thermal conductivity to pure copper (390 W/mK), much higher than the range of metal injection molded copper heat sink (320-340 W/mK), while featuring low silicon-like CTE (~5 ppm/K). This is realized by injection parameter manipulation to not only reduce voids (vacancies) but increase the interface bonding through the use of electrodeposited copper on graphene (i.e., Gr-Cu). Such excellent property locates the Cu/Gr-Cu in the top of the Ashby map and shows excellent temperature stability with a lower thermal distortion parameter (TDP). Thus, this excellent composite material is a suitable material choice simultaneously with high thermal conductivity and low CTE, making it uniquely suited for high power module applications, especially for hybrid and electric vehicles.

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