研究生: |
陳文誌 Wen-Chih Chen |
---|---|
論文名稱: |
單層薄膜出平面微電熱式致動器 A Single Layer Out-of-plane Micro Electro-Thermal Actuator |
指導教授: |
方維倫
Weileun Fang |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2001 |
畢業學年度: | 89 |
語文別: | 中文 |
論文頁數: | 76 |
中文關鍵詞: | 微機電系統 、微電熱式致動器 、出平面運動 |
外文關鍵詞: | MEMS, electro-thermal actuator, out-of-plane actuation |
相關次數: | 點閱:2 下載:0 |
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出平面微致動器應用廣泛,其中利用雙金屬效應達到出平面致動之設計,由於製程簡單,所以被大量採用。然而此類致動器在操作時多半只能單向致動,且會因不同材料間的界面受到剪力作用導致脫層現象,而降低元件之使用壽命。為了有效解決此問題,本文提出採用單一結構層來製作可雙向致動之單層薄膜出平面微電熱式致動器。
本文所提之微致動器是由四根互相平行且截面大小相同的桿件所構成,而內部兩根桿件和外部兩根桿件有一個高度差。當電壓施加在內部的兩根桿件時,則因內部兩根桿件有較大的熱形變量,致使結構產生出平面向上的運動;反之若將電壓施加在外部的兩根桿件時,則會使結構產生出平面向下的運動。經由有限單元模擬以及實驗驗證,其具有操作電壓可低於5V、元件壽命長且至少可致動109次仍無明顯的性能改變、製程容易以及位移量大等優點,將可應用於微繼電器、可變電容及微光學掃描系統等領域。
Out-of-plane electro-thermal actuators have been applied to a variety of fields. Among them, the actuators whose driving method is bi-metal effect have the advantage of simple fabrication processes and are thus most commonly used. However, such an actuator experiences a shear force at the interface of different materials, while actuated. Delamination consequently takes place and therefore decreases its lifetime. In an attempt to overcome the drawback inherent in a bi-metal actuator, a novel bi-directional out-of-plane electro-thermal actuator of single layer thin film material is proposed.
The presented actuator comprises four parallel, identical beams. The two inner beams connect the two outer beams with a step, which enables the inner beams and the outer ones located at different planes. While a current only flows through the inner beams, they would experience a temperature rise; the accompanying thermal expansion therefore enables the actuator to bend upwards. On the contrary, while a current only flows through the outer beams, the actuator would bend downwards. The bi-directional out-of-plane motion is thus achieved. The design was examined in light of finite element analysis. The potential application lies in micro-relays, variable capacitors, and optical scanning system.
[1] W. Riethmuller, and W. Benecke, “Thermally excited silicon microactuators,” IEEE Transactions on Eleltron Device, vol. 35, pp. 758-763, 1988.
[2] W. Benecke, and W. Riethmuller, “Applications of silicon-microactuators based on bimorph structures,” Proceedings of the IEEE MEMS’89 Workshop, Salt Lake City, UT, Feb. 1989, pp. 116 –120.
[3] B. Rashidian, and M.G. Allen, “Electrothermal microactuators based on dielectric loss heating,” Proceedings of the IEEE MEMS’93 Workshop, Ft. Lauderdale, Fla. Feb. 1993, pp. 24 –29.
[4] J.W. Suh, C.W. Storment, and G.T.A. Kovacs, “Characterization of multi-segment organic thermal actuators,” The 8th Int. Conf. Solid-State Sensors and Actuators, and EurosensorsⅨ(Transducer ’95, EurosensorsⅨ), Stockholm, Sweden, Jun. 1995, pp. 333-336.
[5] S. Schweizer, S. Calmes, M. Laudon, and P. Remaud, “Thermal actuated optical microscanner with large angle and low consumption,” Sensors and Actuators A, vol. 76, pp. 470-477, 1999.
[6] X.-Q. Sun, K. R. Farmer, and W. N. Carr, “A bistable microrelay based on two-segment multimorph cantilever actuators,” Proceedings of the IEEE MEMS’98, Heidelberg, Germany, Jan. 1998, pp. 154-159.
[7] J.M. Noworolski, E.H. Klaassen, J.R. Logan, K.E. Petersen, E. Kurt, and N.I. Maluf, “Process for in-plane and out-of plane single-crystal-silicon thermal microactuators,” Sensors and Actuators A, vol. 55, pp. 65-69, 1996.
[8] T. Seki, M. Sakata, T. Nakajima, and M. Matsumoto, “Thermal buckling actuator for micro relays,” in Dig. Tech. Papers, 1997 Int. Conf. Solid-State Sensors and Actuators(Transducer ‘97), Chicago, IL, Jun. 1997, pp. 1153-1156.
[9] J.H. Comtois, and V.M. Bright, “Applications for surface-micromachined polysilicon thermal actuators and arrays,” Sensors and Actuators A, vol. 58, pp. 19-25, 1997.
[10] J.R. Reid, V.M. Bright, and J.H. Comtois, “Automated assembly of flip-up micromirrors,” in Dig. Tech. Papers, 1997 int. Conf. Solid-State Sensors and Actuators(Transducer ‘97), Chicago, IL, Jun. 1997, pp. 347-350.
[11] D.M. Burn, and V.M. Bright, “Design and performance of a double hot arm polysilicon thermal actuator,” SPIE Micromachining and Microfabrication Conference, Austin, TX. Sep. 1997, pp. 296-306.
[12] J.H. Comtois, and M.A. Michalicek, “Characterization of electro-thermal actuators and arrays fabricated in a four-level, planarized surface-micromachined polycrystalline silicon process,” in Dig. Tech. Papers, 1997 Int. Conf. Solid-State Sensors and Actuators(Transducer ‘97), Chicago, IL. Jun. 1997, pp. 769-772.
[13] J.H. Comtois, and M.A. Michalicek, “Electrothermal actuators fabricated in four-level planarized surface micromachined polycrystalline silicon,” Sensors and Actuators A, vol. 70, pp. 23-31, 1998.
[14] J.T. Butler, and V.M. Bright, “Electrothermal and fabrication modeling of polysilicon thermal actuators,” ASME Microelectro-mechanical Systems, Anaheim, CA. Nov. 1998, pp. 571-576.
[15] J.T. Butler, and V.M. Bright, “Average power control and positioning of polysilicon thermal actuators,” Sensors and Actuators A, vol. 72, pp. 88-97, 1999.
[16] O. Ohmichi, Y. Yamagata, and T. Higuchi, “Micro impact drive mechanisms using optically excited thermal expansion,” J. of Microelectromechanical System, vol. 6, pp. 200-207, 1997.
[17] E.T. Carlen, and C.H. Mastrangelo, “Simple, high actuation power, thermally activated paraffin microactuator,” in Dig. Tech. Papers, 1999 Int. Conf. Solid-State Sensors and Actuators (Transducer ‘99), Sendai, Japan, Jun. 1999, pp. 1364-1367.
[18] J.W. Judy, and R.S. Muller, “Magnetic microactuation of torsional polysilicon structures,” The 8th Int. Conf. Solid-State Sensors and Actuators, and EurosensorsⅨ(Transducer ’95, EurosensorsⅨ), Stockholm, Sweden, Jun. 1995, pp. 332-335.
[19] C. Liu, T. Tsao, Y.C. Tai, T.S. Leu, C.M. Ho, W.L. Tang, and D. Miu, “Out-of-plane permalloy magnetic actuators for delta-wing control,” Proceedings of the IEEE MEMS’95 Workshop, Amsterdam, Neth. Jan, 1995 , pp. 7-12.
[20] S.M. Ansari, P.S. Mangat, J. Klein, and H. Guckel, “A multi-level, LIGA-like process for three dimensional actuators,” Proceedings of the IEEE MEMS’96 Workshop, San Diego, CA. 1996 , pp. 285 –289.
[21] T. Yasuda, I. Shimoyama, and H. Miura, “Cmos drivable electro-static microactuator with large deflection,” Proceedings of the IEEE MEMS’97 Workshop, Nagoya, Japan, Jan. 1997 , pp. 90 –95.
[22] J.L.A. Yeh, H. Jiang, and N.C. Tien, “Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator,” J. of Microelectromachanical System, vol.8, pp. 231-237, 1999.
[23] A. Schroth, C. Lee, S. Matsumoto, and R. Maeda, “Application of sol-gel deposited thin PZT film for actuation of 1D and 2D scanners,” Sensors and Actuators A, vol. 73, pp. 144-152, 1999.
[24] 羅炯成, “新型電熱式出平面微致動器之研究,” 國立清華大學動機系碩士論文, 2000.
[25] Q.A. Huang, and N.K.S. Lee, “Analysis and design of polysilicon thermal flexure actuator,” J. Micromech. Microeng, vol. 9, pp. 64-70, 1999.
[26] 賴俊仁,“高濃度硼摻雜矽層蝕刻與應力之研究與應用,” 國立清華大學電機系碩士論文, 1999.
[27] S. A. Campbell, and H. J. Lewerenz, Semiconductor Micromachining. vol. 2, John Wiley & Sons, 1998.
[28] E. Bassous, and A.C. Lamberti, “Highly selective KOH-based etchant for boron-doped silicon structures”, J. Microelectronic Engineering, vol.9, pp. 167-170, 1989.
[29] A. Merlos, M. Acero, M. H. Bao, J. Bausells, and J. Esteve, “TMAH/IPA anisotropic etching characteristics”, Sensors and Actuators A, vol.37-38, pp. 737-743, 1993.
[30] W. P. Lai and W. Fang, “ Novel bulk acoustic wave hammer to determine the dynamic response of microstructures using pulsed broad bandwidth ultrasonic transducers,” The ASME Proceedings of the 2001 International Mechanical Engineering Congress and Exhibition (IMECE) , New York, NY, Sep. 2001.
[31] 林弘毅, “熱形變微閥門之研究,” 國立清華大學動機系碩士論文, 1998.
[32] H.-Y. Lin, H.-H. Hu, W. Fang, and R. S. Huang, “Electrostatically-driven-leverage actuator as an engine for out-of-plane motion,” The 11th Int. Conf. Solid-State Sensors and Actuators(Transducer ’01, Eurosensors XV), Munich, Germany, Jun. 2001, pp. 740-743.