研究生: |
曾柏源 Tseng, Po-Yuan |
---|---|
論文名稱: |
模仁材料與圖案對超音波奈米轉印技術之影響 Impacts of Mold Material and Pattern Size for Ultrasonic Nanoimprint Lithography |
指導教授: |
陳榮順
Chen, Rongshun 林建宏 Lin, Chien-Hung |
口試委員: |
陳宗麟
Chen, Tsung-Lin 邱一 Chiu, Yi |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 奈米工程與微系統研究所 Institute of NanoEngineering and MicroSystems |
論文出版年: | 2012 |
畢業學年度: | 100 |
語文別: | 中文 |
論文頁數: | 72 |
中文關鍵詞: | 奈米轉印 、超音波 、模仁 、電鑄 、鎳 、矽 |
相關次數: | 點閱:2 下載:0 |
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本研究設計以及製造不同材料與圖案的模仁,包含微米矽模仁、次微米矽模仁以及微米鎳模仁,並成功的開發其超音波奈米轉印微影技術。研究結果顯示在室溫下能將不同材料、不同線寬等級的模仁圖案轉印至PET基板上。超音波奈米轉印微影技術主要是利用超音波產生振動使模仁與聚合物產生摩擦並提升溫度至聚合物的玻璃轉換溫度之上,再利用壓力使模仁壓入因高溫軟化的聚合物內。研究中以填滿率作為評量轉印效果品質的性能指標,並利用田口品質方法求得不同形式模仁之最佳化製程參數,最後探討模仁材料以及圖案對超音波奈米轉印微影技術的影響。
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