PCB(Printed Circuit Board)印刷電路板普遍應用於諸多電子商品中，因具有承載電子電路元件、絕緣、散熱、傳輸訊號及電源等功用。隨著傳統電路板的式微，以及線路密度逐漸增加的趨勢，故將以具繞曲特性的軟板、IC載板、HDI板等為未來之主流商品。因此應用產品逐步邁向微小化的發展，輕、薄、短、小、高速且可攜化等方向，導致元件密度與其發熱密度越來越高，除了瑕疵變小外，種類規格也更加多元化，提高了在光學檢測上的難度。
對於廠商以X射線層析攝影合成原理系統所提供的合成影像，本研究提供了有效將瑕疵強化後搭配分離技術的程序，提高了檢測效率，且針對各種檢測目標，依據影像上的特性，提供了改善影像品質的全域影像強化技術，可作為初步提升影像品質的前處理動作，以利後續搭配合適的影像強化及分割技術將檢測目標分離出來。

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