近年來隨著積體電路製程技術的不斷進步，電子元件趨向小體積與高功率，熱能的產生也隨之增加，因此各種導熱材料不斷被研發，期望達到提升散熱的目的。奈米碳管具有高熱導性，適合作為熱導提升之強化材，而高分子材料具有質輕、價格便宜及易塑形等優點，結合二者的優勢可能成為未來功能性熱導材料的主流。
本研究分別以溶液摻混與加壓滲透製程，在矽膠基材中填充不同比例之氮化鋁及多壁奈米碳管製成導熱墊，以了解不同製程和不同比例之填充粉體對矽膠基材熱性質影響。使用有限單元分析軟體ANSYS分析試片等效熱傳導係數，分別建立二維和三維模型，比較不同粉體形狀與粉體數目對模擬結果之影響，並以Maxwell、Bruggeman、Cheng-Vachon模型計算等效熱傳導係數後與實驗結果比較。接著量測試片熱穩定性與機械性質，以了解試片適合的運作環境。最後以場發射掃描式電子顯微鏡觀察試片中粉體分布情形，以了解粉體間是否形成有效的傳熱途徑。

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