藍寶石具有高硬度、良好透光性、化學穩定性，被應用在LED、半導體、光學及通訊產業上。在工程上須先生成藍寶石晶棒，再以切、磨、拋完成所需之輪廓、尺寸及表面精度。只是藍寶石屬於硬脆材料，維氏硬度高達2200 Kg/mm2的特性使磨削加工非常困難。超聲輔助加工在許多研究中擁有提升材料移除量、降低切削力、切削溫度與工件表面粗糙度並且延長刀具壽命的特性。
本研究對二維超聲輔助磨削藍寶石的作用機制和磨削特性進行探討，使磨削過程從脆性轉變成延性移除，建立模型並輔以實驗來驗證。透過其磨削力與比磨削能了解材料移除機制、表面完整性與切屑形成機制。最後獲得二維超聲輔助磨削之加工條件與磨削成果之關係，提供超聲輔助磨削藍寶石時加工應用上的依據，對於使用藍寶石的相關產業有正向幫助。

Sapphire (single-crystal Al2O3) is highly used in LED, semiconductor, optical and communication industries, because of its high hardness, great optical transparency and chemical stability. In engineering applications, sapphire is always required to be thinning and high surface integrity. However, sapphire is very difficult to grind because of extraordinarily hard material property with Vickers hardness 2200 Kg/mm2.Two-dimension ultrasonic assisted grinding (2D-UAG) has been proved to be promising in machining of hard and brittle materials. However, its potential has not been sufficiently developed because the processing mechanism has not been clearly explained.
In this paper, the trajectory of abrasive in different amplitude of 2D-UAG are analyzed. It gives the relationship of amplitude and equivalent chip thickness. The grinding experiments under the existence/non-existence of 2D-UAG are performed. The grinding process transform from brittle to ductile mode. It’s estimated by experiments to verify that the grinding force, specific grinding energy, surface formation mechanism and chip formation of 2D-UAG.

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