隨著資料傳輸與處理速度加快，為了解決傳統金屬走線非理想效應，光通傳輸介面被應用於晶片間或晶片內傳輸，稱為光連結系統。本論文分為五章，前四章分別對光連結系統收發機前端電路進行介紹與設計，並在第五章把前端電路與高速交換機做結合，達到真正整合光電傳輸介面之高速交換機。

With the increasing speed of data transmission and processing, in order to solve the non-ideal effects of conventional electrical interconnect, O/E interface is proposed to be used in chip-to-chip or intra-chip level transmission, known as the optical interconnect (OI). This thesis including five chapters focuses on designing the high-speed optical front-end blocks for OI applications. The first four chapters describe optical transceiver front-end circuits, and the optical front-end blocks are combined with a 4×4 high-speed switch to achieve a fully-integrated high-speed switch with OI interface in chapter 5.

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