研究生: |
邵耀賢 Shao Yao Hsien |
---|---|
論文名稱: |
雷射鑽孔殘留熱應變之探討 |
指導教授: |
王偉中
Wang Wei-Chung |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2004 |
畢業學年度: | 92 |
語文別: | 中文 |
論文頁數: | 96 |
中文關鍵詞: | 雷射鑽孔 、雲紋干涉術 、電子束雲紋法 、Goldak’s熱源模型 |
相關次數: | 點閱:2 下載:0 |
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本研究主要係運用兩種精密光學量測方法在雷射鑽孔的殘留熱應變量測上,首先以雲紋干涉術觀察工件在雷射鑽孔後之熱應變狀態,接著利用電子束雲紋法探討工件在雷射鑽孔後之孔周圍的熱應變狀態。本研究另利用商用有限單元分析軟體ANSYS,加上Goldak等人所提之熱源模型,以輔助探討工件在雷射鑽孔的熔融過程和應變狀態。
[1] “ANSYS Revision 5.1”, Swanson Analysis Systems Inc., Houston, PA, U.S.A., 1993.
[2] J. Goldak, A. Chakravarti and M. Bibby, “A New Finite Element Model for Welding Heat Sources ”, Metallurgical Transacations B, Vol. 15B, pp. 299-305, 1984.
[3] J. Guild, “The Interference System of Crossed Diffraction Gratings”, Clarendon Press, Oxford, 1956.
[4] D. Post and J. D. Wood, “Determination of Thermal Strains by Moiré Interferometry”, Experimental Mechanics, Vol. 29, pp. 318-322, 1989.
[5] X. Dai and P. S. Ho, “Thermo-Mechanical Deformation of Under-Filled Flip-Chip Packaging”, IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, Austin, TX USA, pp. 326-333, Oct. 13-15, 1997.
[6] J. Wang, Z. Qian, D. Zou and S. Liu, “Creep Behavior of a Flip-Chip Package by both FEM Modeling and Real Time Moiré Interferometry”, Electronic Packaging, Vol. 120, pp. 179-185, 1998.
[7] M. R. Miller, I. Mohammed, X. Dai, N. Jiang and P. S. Ho, “Analysis of Flip-Chip Packages Using High Resolution Moiré Interferometry”, Electronic Components and Technology Conference, San Diego, California, USA, pp. 979-986, June 1-4, 1999.
[8] D. W. Robinson, “High Resolution Moiré Contouring by a Hybrid Technique Combining Light and Electron Optics”, Opt. Laser Technol., Vol. 13, pp. 145-149, 1981.
[9] J. W. Dally and D. T. Read, “Electron-Beam Moiré”, Exp. Mech., Vol. 33, pp. 270-277, 1993.
[10] D. T. Read and J. W. Dally, “Electron-Beam Moiré Study of Fracture of a Glass Fiber Reinforced Plastic Composite”, Trans. Amer. Soc. Mech. Eng., Vol. 61, pp. 402-409, 1994.
[11] D. T. Read, E. S. Drexler, M. A. Schen, H. Abe and E. Schir, eds., “Local Deformation of Plated Through Holes under Thermomechanical Loading”, Proc. of ASME 1994 International Mechanical Engineering Congress and Exposition, Mechanics and Materials for Electronic Packaging, Vol. 2, Thermal and Mechanical Behavior and Modeling AMD-187, Chicago, IL. New York USA, pp. 185-194, Nov. 6-11, 1994.
[12] D. T. Read and J. W. Dally, “Theory of Electron-Beam Moiré”, J. Res. Natl. Inst. Stand. Technol., Vol. 101, pp. 47-61, 1996.
[13] X. Huimin, S. Kishimoto, N. Shinya, D. Fulong, Z. Daqing and L. Sheng, “Thermal Deformation Measurement of The Solder Joints in Electronic Packages Using Electron Moiré Method”, Strain, pp. 127-130, Nov. 1999.
[14] X. Huimin, C. G. Boay, A. Asundi, J. Yu, L. Yunguang, B.K.A. Ngoi and Z. Zhaowei, “Thermal Deformation Measurement of Electronic Package Using Advanced Moiré Methods”, Electronics Packaging Technology Conference, pp. 163-168, 2000.
[15] N. Iwata, M. Matsui, N. Nakagawa and S. Ikura, “Improvements in Finite-Element Simulation for Stamping and Application to the Forming of Laser-Welded Blanks”, Journal of Materials Processing Technology, Vol. 50, pp. 335-347, 1995.
[16] Y. N. Liu and E. J. Kannatey-Asibu, “Finite Element Analysis of Heat Flow in Dual-Beam Laser Welded Tailored Blanks”, Journal of Manufacturing Science and Engineering, Transactions of the ASME, Vol. 120, No. 2, pp. 272-278, 1998.
[17] 陳力俊, 張立, 梁鉅銘, 林文台, 楊哲人和鄭晃忠, “材料電子顯鏡學”, 國科會精密儀器發展中心, 1994.
[18] D. Post , B. Han and P. Ifju, “High Sensitivity Moiré ”, Springer-Verlag, New-York, 1994.
[19] 林三寶, “雷射原理與應用”, 全華科技圖書股份有限公司, 1991.
[20] 蘇品書, “雷射原理與應用技術”, 復漢出版社, 1993.
[21] 丁勝懋, “雷射工程導論”, 中央圖書出版社, 1995.
[22] V. Pavelic, R. Tanbakuchi, O. A. Uychara and P. S. Myers “Welding Journal Research Supplemem”, Vol. 68, pp. 295-305, 1969.
[23] Website: http://www.jeol.com/sem/jsm_5500.html.
[24] Website: http://www.kjet.com.tw/.
[25] J. R. Davis and P. Allen, “Properties and Selection : Nonferrous Alloys and Special-Purpose Materials”, ASM Handbook, Vol. 2, 1990.
[26] “Matlab”, Version 5.3, The MathWorks, Inc., Natick, Mass., USA., R11.
[27] D. T. Read and J. W. Dally, “Local Strain Measurements by Electron Beam Moiré”, Proc. ASME 1993 International Electronics Packaging Conference, Advances in Electronics Packaging, Vol. 1, Structural Analysis Materials and Processes Design Reliability, EEP-4-1, 1993, Sept. 29-Oct. 2, Binghamton. N.Y., New York, pp. 163-169, 1993.
[28] 王偉中, “光測力學方法及應用實例概述”, 科儀新知, pp.65-67, 1996年2月.
[29] 吳俊生, “以雲紋干涉術探討機械加工對於電子封裝體熱行為之影響”, 國立清華大學動力機械工程學系碩士論文, 2002.
[30] 王峰, 曹光宇, “簡明實驗力學”,科學出版社, 141-159, 1993.
[31] S. Kishimoto, M. Egashira, N. Shinya, “Micro-Creep Deformation Measurement by a Moiré Method Using Electron-Beam Scan”, Optical Eng., Vol. 32, No. 2, pp. 522-526, 1993.
[32] Y. Morimoto and T. Hayashi, “Deformation Measurement During Powder Compaction by a Scanning Moiré Method”, Exp. Mech.,
Vol. 24, No. 2, pp. 112-116, 1984.
[33] J. W. Dally, D. T. Read and M. Szanto, “Scanning Moiré at High Magnification Using Optical Method”, Exp. Mech., Vol. 33, No.2, pp. 110-116, 1993.
[34] 張振燦, “雷射與加工”, 亞太圖書出版社, 1986.
[35] S. Kishimoto, X. Huimin and N. Shinya, “Electron Moiré Method and its Application to Micro-Deformation Measurement ”, Optics and Lasers in Engineering, Vol. 34, pp. 1-14, 2000.