本論文以外部全域性晶圓級磁場，在晶片局部區域上感應產生渦電流，作為研究主軸，並發展出相關應用。首先，本論文以理論及實驗方式，探討當元件縮小之後，渦電流對微結構幾何形狀變化之行為特性，此外也輔以材料的特性，使晶片在高功率交變磁場中，由渦電流造成局部感應加熱。其次，本論文針對微尺度下渦電流之特性，發展出三種應用：(1) 電磁感應局部加熱之微機電元件晶圓級封裝。以微電鍍鎳之區域感應形成渦電流，並快速產生高溫使焊料回焊達到晶圓級焊料接合；(2) 三維微結構之出平面定位及焊接。利用交變磁場抬升及定位微結構，同時在晶片上產生局部高溫焊接區，再以微焊接方式將出平面抬升結構焊接固定；(3) 無線圈式勞倫茲力掃描器。渦電流與外部永久磁鐵的搭配亦可產生出勞倫茲力，這個想法可達到以非接觸方式產生電場以及磁場，以渦電流代替致動區域電流佈線線圈，以此方式應用於以勞倫茲力驅動之微掃描面鏡，由於感應渦電流屬於面電流，會感應並分佈於電鍍鎳微鏡面上，這使得勞倫茲力分佈於整個鎳微鏡面上，而降低製程複雜性提高元件良率，並可以較小的功率驅動產生較大的位移。

Eddy current is a promising induction heating and actuation approach for MEMS processes and devices. This study has discussed the scale effect of eddy current for mirco electroplating microstructures through the analytical and experimental means. The results show that the induction heating rising temperature varies with the in-plane surface area of microstructure and the relative permeability of thin-film materials. Moreover, the shape of microstructure also leads to the different of rising temperature. Thus, localized heating is achieved on substrate by applying an external high frequency magnetic field. It is also easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature regions on substrate.
Three applications are presented in this study: (1) Localized heating for wafer level packaging. The electroplated thick film acts as a heater and a spacer. It takes only several seconds to complete the solder reflow and bonding process, and hermetic seal of the packaged device is achieved. The bonding strength is up to 18 MPa. The integration the MUMPs devices with this packaging technique have been demonstrated; (2) Localized positioning and welding for 3D microstructures. The lifting and welding can be localized by the magnetic film. Moreover, a global wafer level process can be achieved by the magnetic field; (3) Coil-less Lorentz force for optical scanner. The eddy current is induced in ferromagnetic material by solenoid, thus, the complicated coil routing and insulation layer deposition for current is prevented. This study demonstrated a 2D scanning mirror with 20 mechanical scan angles when operated at 100mV and 0.016mA.

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