電子產業之快速發展，電子產品除追求高速度，多功能之設計外，外形輕、薄、短、小亦為發展趨勢，有別於一般傳統封裝之覆晶（flip chip）因具備眾多優點，而於現今封裝技術中，有舉足輕重的角色；為提升覆晶之可靠度需藉由一特殊材料，稱為底膠填充（underfill），以降低於覆晶凸塊之應力與應變集中現象，但此種底膠填充材料與一般電路版之黏著強度優劣，為影響覆晶元件可靠度之重要因素。
本研究藉由實驗模擬元件所可能遭遇之環境，將熱力環境與溼度環境交互影響後，依不同之應變速率及不同的黏著介面，進行剪力試驗，得知升高溫度與濕度，介面強度皆會因材料軟化與水氣滲入，造成介面剪力強度明顯下降，且不論經歷何種環境歷程與實驗條件，試片破壞面皆發生於防焊漆與FR-4間，故所得之強度為防焊漆與FR-4之黏著強度；而比較不同之黏著介面，發現於相同環境下，底膠填充與FR-4面黏著之介面強度值，較防焊漆與FR-4之黏著強度值為高。

故可知防焊漆與FR-4間，較易受溫度與濕度影響其介面黏著強度，且鑑於一般電路板表面皆塗覆防焊漆，因此可知防焊漆與FR-4黏著面抵抗因溫度與濕度造成黏著強度下降，為提升電子元件可靠度之重要關鍵。

1. John H. Lau, “Low Cost Flip Chip Technologies,” McGraw-Hill, New York, 2000.
2. Y. Rao, S. H. Shi, and C. P. Wong, “A Simple Evaluation Methodology of Young’s Modulus-Temperature Relationship for the Underfill Encapsulants,” Electronic Components and Technology Conference, pp.784-789, 1999.
3. Sung Yi, Jing Sua Goh, and Ji Cheng Yang, “Residual Stresses in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test,” IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B, Vol. 20, No. 3, pp. 247-255, August 1997.
4. Zhengfang Qian, Jian Yang, and Sheng Liu, “Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills,” Electronic Components and Technology Conference, pp.969-974, 1998.
5. Robert Darveaux, Laura Norton, and Frank Carney, “Temperature Dependent Mechanical Behavior of Plastic Packaging Materials,” Electronic Components and Technology Conference, pp.1054 –1058, 1995.
6. Wei Ren, Zhengfang Qian, and Sheng Liu, “Scale Effect on Packaging Materials,” Electronic Components and Technology Conference, pp.1229-1234, 1999.
7. John Lau, Chris Chang, and Ray Chen, “Effects of Underfill Encapsulant on the Mechanical and Electrical Performance of a Functional Flip Chip Device,” Polymeric Electronics Packaging , pp. 265 –272, 1997.
8. H. L. Tay and C. Q. Cui, “Underfill Material Requirements for Reliable Flip Chip Assemblies,” IEEE/CPMT Electronics Packaging Technology Conference, pp. 345 –348, 1998.
9. Qizhou Yao, Jianmin Qu, Jiali Wu, and C. P. Wong, Fellow, IEEE, “Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives.” IEEE Transactions on Electronics Manufacturing, Vol. 22, No. 4, pp. 264 –267, October 1999.
10. Haiying Wang, Zengfang Qian, Sheng Liu, “Mechanical Modeling of Underfills Based on Two-phase Composites,” Electronic Components and Technology Conference, pp. 803 –808, 1999.
11. Jianmin Qu and C. P. Wong, “Effective Elastic Modulus of Underfill Material for Flip-Chip Applications,” Electronic Components and Technology Conference, pp. 848 –850, 1998.
12. Jianjin Wang, Minfu Lu, Wei Ren, Daqing Zou, and Sheng Liu, Associate Member, IEEE, “ A Study of the Mixed-Mode Interfacial Fracture Toughness of Adhesive Joints Using a Multiaxial Fatigue Tester,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 2, pp. 166 –173, April 1999.
13. Alex Gladkov and Avram Bar-Cohen, “Parametric Dependence of Fatigue of Electronic Adhesives,” Components and Packaging Technologies, Vol. 22, No. 2, June 1999.
14. Vadim Gektin, Member, IEEE, Avram Bar-Cohen, Fellow, IEEE, and Jeremy Ames, “Coffin-Manson Fatigue Model of Undferfill Flip-Chips,” IEEE Transactions on Components, Packaging, and Manufacturing - Part A, Vol. 20, No. 3, September 1999.
15. W. Ren, J. Wang, Z. Qian, D. Zou and S. Liu, “Investigation of Nonlinear Behaviors of Packaging Materials and Its Application to a Flip-Chip Package,” International Symposium on Advanced Packaging Materials, pp. 31 –40, 1999.
16. Xiang Dai and Paul S. Ho, “Thermo-mechanical Deformation of Underfilled Flip-Chip Packaging,” IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, pp. 326 –333, 1997.
17. Qizhou Yao and Jianmin Qu, “Effect of Thermal Residual Stresses on the Apparent Interfacial Toughness of Epoxy/Aluminum Interface,” International Symposium on Advanced Packaging Materials, pp. 333 –336, 1999.
18. John H. Lau, S-W. Ricky Lee, Chris Chang and Chien Ouyang, “Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board with Imperfect Underfill Encapsulants,” Electronic Components and Technology Conference, 1999.
19. Sheng Liu, Member, IEEE, and Yuhai Mei, “Behavior of Delaminated Plastic IC Packages Subjected to Encapsulation Cooling, Moisture Absorption, and Wave Soldering,” IEEE Transactions on Components, Packaging, and Manufacturing Technology --- Part A. Vol. 18, No. 3, September 1995.
20. Xiang Dai, Mark V. Brillhart, and Paul S. Ho, “Polymer Interfacial Adhesion in Microelectronic Assemblies,” Electronic Components and Technology Conference, pp. 132 –137, 1998.
21. X. J. Fan, H. B. Wang & T. B. Lim, “Investigation of the Underfill Delamination and Cracking in Flip-Chip Modules under Temperature Cyclic Loading,” Electronic Components and Technology Conference, pp. 994 –1000, 1999.
22. Jianjun Wang, Minfu Lu, Daqing Zou, and Sheng Liu, Associate Member, IEEE, “Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load,” IEEE Transactions on Components, Packaging, and Manufacturing Technology --- Part B, Vol. 21, No. 1, pp. 79 –86, February 1998.
23. John H. Lau, Fellow, IEEE, Chris (Chia-Po) Chang, Member, IEEE, and S.-W. Ricky Lee, Member, IEEE, “Failure Analysis of Solder Bumped Flip Chip on Low-Cost Substrates,” IEEE Transactions on Electronic Packaging Manufacturing, Vol. 23, No. 1, pp.19 –27, January 2000.
24. A. J Kinloch, “Adhesion and Adhesives,” Chapman and Hall, New York, 1987.
25. ASTM D3165-91, “Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading of Single-Lap-Joint Laminated Assemblies,” Annual Book of ASTM Standard, Vol. 15.06, pp. 217-220, 1991.
26. ASTM D2093-97, “Standard Practice for Preparation of Surface of Plastics Prior to Adhesive Bonding,” Annual Book of ASTM Standard, Vol. 15.06, pp. 130-131, 1997.
27. ASTM D1151-90, “Standard Test Method for Effect of Moisture and Temperature on Adhesive Bonds,” Annual Book of ASTM Standard, Vol. 15.06, pp. 64-65, 1995.