目前市面上的觸覺感測晶片採用打線接合(Wire Bonding)的方式以進行封裝，然而觸覺感測晶片的使用情境會與外界物體接觸，造成金屬線可能被壓壞的風險。因此，本研究提出利用覆晶技術(Flip Chip Bonding)於觸覺感測晶片之實現，且其製程相對其他解決方式簡單。此外，本研究利用深反應式離子蝕刻製程可彈性地定義背腔幾何形狀以調變參數，並填充高分子於背腔中，使高分子被集中在特定區域內作為力量傳遞的媒介，藉由高分子的流變性以探討不同背腔形狀對元件性能的影響。

Currently, tactile sensors on the market are often packaged by wire bonding, however, the using situation of tactile sensors may usually contact with objects, resulting in the risk of the metal wires being damaged. Therefore, this study proposed the usage of “Flip Chip Bonding” technique in the realization of tactile sensors which has simpler and better fabrication process than other methods. In addition, we utilized the Deep Reaction Ion Etching (DRIE) process to modulate the parameters by flexibly defining the geometry of the backside cavity, followed by filling the backside cavity with polymer in order to concentrate the polymer in a specific area acting as a medium for force transmission. With the rheology of the polymer, we can investigate the performance of tactile sensors by varying the geometry of backside cavity.

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