本研究主要是利用散射光彈法(Scattered-light Photoelastic Method)探討受熱負載含缺陷群雙層材料構件之三維應力情形。本實驗利用綠光雷射光切片對含缺陷群PLM-4B光彈試片之表層、次表層及中層做照射，以得到三層之暫態條紋影像，再利用散射光彈法理論取得試片之次主應力差值，並且搭配有限元素法之商用軟體ANSYS做分析，由ANSYS結果亦可得到實驗無法得到之介面應力及孔邊應力。
本研究是目前唯一使用散射光彈方法來探討含缺陷群雙層材料受熱負載之三維應力情形，為非破壞性應力量測方法，可避免應力凍結法之繁複切片過程。

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