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研究生: 紀誌晟
Chi, Chih-Cheng
論文名稱: 一個適用於CMOS影像感測器的高精度二階雜訊整形漸進式類比數位轉換器
A High-Precision Second-Order Noise-Shaping SAR ADC for CMOS Image Sensors
指導教授: 徐永珍
Hsu, Klaus Yung-Jane
口試委員: 賴宇紳
Lai, Yu-Sheng
黃吉成
Huang, Ji-Chang
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電子工程研究所
Institute of Electronics Engineering
論文出版年: 2025
畢業學年度: 113
語文別: 中文
論文頁數: 80
中文關鍵詞: 雜訊整形漸進式類比數位轉換器浮動式反向器放大器誤差調變開關電容積分器低回踢雜訊動態比較器量化誤差
外文關鍵詞: Noise-Shaping SAR ADC, Floating Inverter Amplifier, Mismatch Error Shaping, Switched-Capacitor Integrator, Low Kickback Noise Comparator, Quantization Error
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  • 本研究提出一種應用於CMOS影像感測器後端的高精度、低功耗ADC架構,旨在突破傳統單斜率(Single Slope)ADC在解析度與速度上的限制,滿足高解析度影像感測的需求。針對精準度和功耗的雙重要求,本設計採用基於Vcm的轉換方式,並加入誤差調變技術以有效抑制製程中電容陣列不匹配(Mismatch)帶來的誤差。此外,為解決此架構易受回踢雜訊影響的問題,本研究引入了低回踢雜訊比較器,確保系統穩定運行。
    在雜訊整形的實現上,採用了由浮動式反向器放大器構成的動態放大器,此設計不僅提供更為激進的雜訊轉移函數,還進一步降低了功耗。在10MHz取樣頻率下,本設計目標達到超過12位元的有效位元(ENOB),預期頻寬為625KHz,使得在1080p、30幀/秒的影像感測應用中,每19條Column可共用一顆ADC,大幅降低功耗與佈局面積需求。
    本論文電路是在TSMC 90nm 1P9M CMOS製程下實現,晶片總面積包含TSMC的 ESD I/O pad為1.361×1.102 mm2,核心電路面積為0.887×0.667 mm2。此類比數位轉換器的供應電壓為1.2V、取樣頻率10 MHz。模擬在頻寬為625KHz時有效位元(ENOB)為13.43bits、頻寬為312.5KHz時ENOB為14.57bits。在量測結果中,頻寬為625KHz時有效位元(ENOB)為12.21bits、頻寬為312.5KHz時ENOB為13.91bits。


    This study proposes a high-precision, low-power ADC architecture for the back-end of CMOS image sensors, aiming to overcome the limitations of traditional Single Slope (SS) ADCs in resolution and speed, thereby meeting the demands of high-resolution image sensing. To address the dual requirements of accuracy and power consumption, this design employs a Vcm-based conversion approach and incorporates error modulation techniques to effectively suppress errors caused by capacitor array mismatches during the manufacturing process. Additionally, to mitigate the issue of kickback noise affecting the architecture, a low-kickback noise comparator is introduced, ensuring stable system operation.
    For noise shaping, a dynamic amplifier composed of a floating inverter amplifier is utilized. This design not only offers a more aggressive noise transfer function but also further reduces power consumption. At a sampling frequency of 10 MHz, the proposed design targets an effective number of bits (ENOB) exceeding 12 bits with an expected bandwidth of 625 KHz. This allows each ADC to be shared among 19 columns in 1080p, 30 fps image sensing applications, significantly reducing power consumption and layout area requirements.
    The circuit in this work is implemented using the TSMC 90nm 1P9M CMOS process. The total chip area, including the TSMC ESD I/O pads, is 1.361 × 1.102 mm², while the core circuit area is 0.887 × 0.667 mm². This analog-to-digital converter operates at a supply voltage of 1.2V and a sampling frequency of 10 MHz. Simulations show an ENOB of 13.43 bits at a bandwidth of 625 KHz and 14.57 bits at 312.5 KHz. Measured results indicate an ENOB of 12.21 bits at 625 KHz and 13.91 bits at 312.5 KHz.

    致謝 i 摘要 ii Abstract iii 圖目錄 vii 表目錄 ix 第一章 緒論 1 1.1 研究動機 1 1.2 架構選擇 2 1.3 設計目標 4 1.4 論文章節架構 4 第二章 ADC介紹 6 2.1 基本名詞 6 2.1.1 奈奎斯特定理(Nyquist Theorem) 6 2.1.2 量化誤差(Quantization Error) 7 2.1.3 解析度(Resolution) 8 2.1.4 過取樣(Oversampling) 8 2.2 ADC靜態規格 9 2.2.1 偏移誤差(Offset Error) 9 2.2.2 增益誤差(Gain Error) 10 2.2.3 微分非線性(Differential Nonlinearity, DNL) 11 2.2.4 積分非線性(Integral Nonlinearity, INL) 11 2.3 ADC動態規格 12 2.3.1 訊號雜訊比(Signal-to-Noise Ratio, SNR) 12 2.3.2 總諧波失真(Total Harmonic Distortion, THD) 13 2.3.3 訊雜失真比(Signal-to-Noise-and-Distoration Ratio, SNDR) 13 2.3.4 有效位元(Effective Number of Bits, ENOB) 13 2.4 ADC架構介紹 13 2.4.1 SAR ADC 13 2.4.2 Σ-Δ調變器(Sigma-Delta Modulator, SDM) 14 2.4.3 雜訊整形循序漸進式類比數位轉換器(Noise Shaping SAR ADC) 15 第三章 電路架構 17 3.1 整體架構 17 3.2 靴帶式開關(Bootstrap Switch) 19 3.3 電容陣列(Capacitor Array) 20 3.4 低回踢雜訊動態比較器(Low Kickback Noise Comparator) 21 3.5 連續漸進式轉換邏輯(Successive Approximation Register Logic) 23 3.6 浮動式反向器放大器(Floating Inverter Amplifier, FIA) 24 3.7 開關電容積分器(Switched-Capacitor Integrator) 26 3.8 誤差調變和數位錯誤校正電路(Mismatch Error Shaping and Digital Error Correction, MES&DEC) 30 第四章 模擬與佈局 32 4.1 設計流程 32 4.2 模擬方法與環境介紹 33 4.3 Pre simulation 34 4.3.1 取樣電路線性度測試 34 4.3.2 比較器input-referred noise測試 35 4.3.3 整體電路性能測試 36 4.3.4 考慮電容陣列mismatch以及驗證MES之作用 40 4.3.5 考慮量測時因打線等電感效應對晶片之影響 42 4.4 佈局介紹 44 4.4.1 子電路佈局 44 4.4.2 整體電路佈局 46 4.5 Post simulation 47 4.6 模擬結果與文獻比較 48 第五章 量測環境設計與結果 50 5.1 印刷電路板(Printed Circuit Board, PCB)設計 50 5.1.1 PCB Schematic 50 5.1.2 PCB Layout 50 5.2 量測設定 52 5.3 量測結果與討論 55 5.3.1 驗證Noise-shaping功能 55 5.3.2 驗證Mismatch Error Shaping功能 56 5.3.3 使用Power Supply供電量測 61 5.3.4 利用電池供電量測 62 5.3.5 功耗量測 66 第六章 總結與後續研究建議 67 6.1 總結 67 6.2 後續研究建議 67 6.2.1 C-DAC選擇 67 6.2.2 佈局優化 68 6.2.3 PCB設計 69 6.2.4 MES量測問題 70 6.2.5 功耗過大問題 73 參考文獻 74 附錄 量測資料 77

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