主要針對封裝材料中具吸水性之有機材料，如基板(Substrate)、軟線板(Flex Circuit)和環氧樹脂封膠(Epoxy Molding Compound, EMC)進行材料實驗，探討溼度對其機械性質之影響，以建立材料對溼度之相關特性資料庫，以因應不同領域使用電腦模擬分析之需求。由實驗結果顯示，溼度對材料的機械性質有一定程度的影響，其極限強度和楊氏模數會隨溼度的上升而下降；在基板承受靜態拉伸時，會因基板內部的脫層現象而導致其應力下降。

Analysis and experiment for the mechanical behavior of increasing and decreasing moisture in 3D MCM constituent polymer materials have been carried out. In experiment, the diffusion process of increasing and decreasing moisture of the 3D MCM constituent polymer materials were performed in the hygrothermal chamber and oven. The electronic balance was used to measure the net weight gain and loss of the 3D MCM constituent polymer materials.
In analysis, the characteristic curves of material models of 3D MCM constituent materials were established to assess, the moisture dependent properties of electronic materials based on the experimental results.

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