本研究係針對高分子導電複合材料(Polymer Conductive Composite, PCC)的正溫度係數(Positive Temperature Coefficient, PTC)行為，進行一系列的實驗與探討。研究的主題包括：導電粒子的製備，聚醯亞胺(Polyimide)基材，聚苯乙烯-丙烯酸正丁酯(Polystyrene-co-butylacrylate)基材，複合電阻膜的熱-電性質(Thermal-electrical property)，尤其側重於上述這些組合對於正溫度係數行為所造成的影響。期望透過本研究的發現，能對於這類型導電複合材料在電子封裝、民生用途這兩大領域，開創新局。特別是可撓式的應用(Flexible application)，更是我們寄希望之所在。

This study is mainly to discuss the positive temperature coefficient (PTC) effect of Polymer Conductive Composite (PCC), which includes the preparation for Ni composite particle, polyimide and polystyrene-co- butylacrylate matrix, particularly the temperature-resistance behavior of composite films. What would be the impact to PTC feature for composite film, by changing the combination of above factors, as well as the process, is our major interest in overall study.
The study consists of 3 main topics:
Part I. Micro Ni-plated SiO2 particle/polyimide matrix system
Part II. Core-shell type P(S-DVB) Ni-plated particle/P(S-co-nBA) matrix system
Part III. The thickness-direction PTC feature of micro Ni powder/ polyimide matrix system

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