在過去的十年中，因為晶片製造技術的提升使得電腦的處理速度大幅增加，熱管如今被廣泛的運用在筆記型電腦與個人電腦產品等電子產品。因為熱管工作溫度大多小於100℃，所以其中必須要將空氣抽出以降低壓力，工作流體的雙相變化才較容易發生。因此，熱管的性能不僅取決於幾何參數，如壁厚、管材料，還有工作流體之熱力性能，如潛熱，蒸汽壓力，粘度，壓力和真空。
本文主題是探討真空度與填充量對熱管的影響，利用最大熱傳量實驗平台，測試熱管在0.1torr~10torr真空度下，以及0.5ml~1ml填充量之熱管的最大熱傳量，這些數據將以實驗和模擬做基準比較並得到一理想結果，經過實驗，最大熱傳量在模擬和實驗上之偏差值均小於10 ％，實驗顯示當NCG越少，真空度越大時，Qmax會越大，反之則減少，且呈現一指數函數的曲線。而填充量則必須超過熱管毛細結構體積的一定比例，才會使得熱管有最好的效能。

Over the last decade, the computer clock speed drastically increases as the chip manufacturing technique improves. Heat pipe generally is already applied to the heat&removed system, the notebook and other equipments. Due to the reason of the operation temperature of the CPU need to less than 100℃, a high vacuum status of the heat pipe must design for achieved to high heat transport ability. Therefore, the heat pipe performance ability not only depends on the geometric parameters such as heat pipe wall thickness、tube material etc., but also depends on the working fluid thermo properties such as latent heat、 vapor pressure、viscosity、inventory and vacuum pressure etc.. The purpose of this study was to evaluate the effect of the inventory and the vacuum pressure to the maximum heat transport ability of the heat pipe. The experiment was operated under the vacuum pressure of the heat pipe at the range of 0.1torr to 10torr, while the inventory was controlled with the range of 0.5ml to 1ml. The results shown the errors between the experimental data and the theoretical value were within 10%. The experiment was also shown when the higher of the vacuum pressure, the lower of the non&condensable gas (NCG), the higher of the maximum heat transport ability (Qmax). The curve for the Qmax with respect to the vacuum pressure turns out to be an exponential function. Keywords: Heat Pipe, Vacuum Pressure, Maximum Heat Transfer, Non&condensation Gas (NCG), inventory

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