研究生: |
張文鏵 Zhang, Wen-Hua |
---|---|
論文名稱: |
以熱電致冷器改善熱管性能量測平台之不穩定性 Using Thermoelectric Cooling Chip (TEC) to Improve the Stability of Heat Pipe Performance Test Instrument |
指導教授: |
林唯耕
Lin, Wei-Keng |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
原子科學院 - 工程與系統科學系 Department of Engineering and System Science |
論文出版年: | 2010 |
畢業學年度: | 98 |
語文別: | 中文 |
論文頁數: | 76 |
中文關鍵詞: | 熱管 、熱損失 、最大熱傳量 、熱電致冷器 |
外文關鍵詞: | Heat Pipe, Heat loss, Maximum Heat Transfer, Thermoelectric Cooling Chip |
相關次數: | 點閱:2 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
熱管是一種高熱傳導性的移熱裝置,它主要是利用內部工作流體在相變化時所具有的潛熱來傳送熱量,在操作溫度範圍內進行雙相熱傳來傳遞大量熱能的工具,因此可稱為熱的超導體(super conductor)。
利用熱管將主要發熱源產生的熱量傳到外部,除了有效解決小空間散熱的問題,同時兼顧到無噪音、不須提供額外能量的優點。所以目前熱管普遍應用於電器、電子零件的冷卻應用,其所應用的範圍非常廣泛。因此準確量測熱管的性能就變的非常重要。
本研究主要的目的為分析「熱管性能量測平台」的冷凝部各參數對於熱管性能量測準確度的影響。分別針對熱管性能量測平台之熱損失及內熱阻量測模式做探討;對於冷凝端水冷結構重新設計,以有效的提升冷凝部的移熱效率,減少量測過程中的熱損失,將熱管性能量測平台之熱損失控制在10%以內,並且準確的量測冷凝部內熱管溫度及熱管本身的內熱阻,以增加熱管性能測試的準確性。
此外,建立一套TEC Controller(熱電致冷器溫度控制機台)設備,將熱電致冷器(TE Cooler)運用在熱管性能測試平台冷凝部,可以精準並快速的對於冷凝部及絕熱部做溫控,以縮短實驗的時間並提昇熱管性能量測的準確性。
關鍵字: 熱管、熱損失、最大熱傳量、熱電致冷器
Heat pipe is a device of high heat-conduction. It mainly uses inside fluid to convey heat energy while the phase is changing. It’s a tool which can transmit a large amount of heat energy in operating temperature while phase is changing. Therefore, heat pipe also named the superconductor.
Using heat pipe transmit the heat energy of the heater source to outside, it is not only solving the problem of heat elimination in small space but also noiseless, and it does not need to offer extra energy. Heat pipe is presently applying to the cooling of the electric equipment, and it uses extremely extensively. So, it’s very important to measure the performance of heat pipe.
The major purpose of this study analysis the condenser parameters of Heat Pipe Performance Test Instrument (HPPTI) which affects the accuracy of the heat pipe performance. The study is aimed at discussing with the heat loss problems of HPPTI and the model of thermal resistance. Improving the section of water-cooling structure could increase the efficiency of heat remove, and reduce the heat loss problem in measuring process. It also could keep the heat loss of HPPTI under 10% and accurately measure the temperature inside the heat pipe and the thermal resistance in the condenser. Hence, it could increase the accuracy of HPPTI.
Moreover, setting up an equipment named ” TEC controller ” (Thermoelectric Cooling Chip Controller) to measure the condenser section of HPPTI, which can exactly control the temperature in adiabatic section and condenser section. Therefore, it is effective to reduce the experimenting time and increase the accuracy of HPPTI.
Key word: Heat Pipe、heat loss、Maximum Heat Transfer 、Thermoelectric Cooling Chip
1. Kenichi Namba, Naoki Kimura, Jun Niekawa, Yuichi Kimura, Nobuyuki Hashimoto, ” Heat-Pipes for Electronic Devices Cooling and Evaluation of Their Thermal Performance ”, IEEE, InterSociety Conference on Thermal Phenomena, pp.456-459,1998.
2. Ioan Sauciuc, “ The Design and Testing of the Super Fiber Heat pipes for Electronics Cooling ”, IEEE, Sixteenth IEEE SEMI-THERM, pp.27-32, 2000.
3. V. Maziuk, “Miniature heat-pipe thermal performance prediction tool software development “, Applied Thermal Engineering 21(2001) 559-571.
4. Seok Hwman Moon, “Experimental Study on the Performance of Miniature Heat Pipes With Woven-Wire Wick”, IEEE Transaction on components and packing technologies,24, No. 4, 1521-3331, December 2001
5. Lanchao Lin, Rengasamy Ponnappan, John Leland “High performance miniature heat pipe” International Journal of Heat and Mass Transfer, Volume 45, Issue 15, July 2002, Pages 3131-3142
6. Kwang-Soo Kim, ” Heat pipe cooling technology for desktop PC CPU ”, Applied Thermal Engineering 23 (2003) 1137-1144.
7. Yasumi Sasaki, Yuichi Kimura, Kenichi Namba, ”The ultra-thin sheet-shaped heat pipe “Pera-flex” ”, 13th International Heat Pipe Conference (13th IHPC), pp250-255, 2004
8. T. Kaya, R. Pérez, C. Gregori, A. Torres “Numerical simulation of transient operation of loop heat pipes” Applied Thermal Engineering, Volume 28, Issues 8-9, June 2008, Pages 967-974
9. Ioffe, A. F., Semiconductor Thermoelements and Thermoelectric Cooling, Infosearch, London, 1957.
10. Goldsmid, H. J., The use of semiconductors in thermoelectric refrigeration, Research Laboratories, The General Electric Co. Ltd, Wembley, Middlesex, 1954.
11. Chu, R. C., 2000, “Application of Thermoelectric Cooling to Electric Equipment:A Review and Analysis,’ Semiconductor Thermal Measurement and Management Symposium, pp.1-9, 2000.
12. Solbrekken, G. L., K. Yazawa, and A. Bar-Cohen, 2003, Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices, Proceedings of InterPack 2003, Maui, HA, Jul 6-11, Paper IPACK2003-35305.
13. Jim Bierschenk, Dwight Johnson, Extending the Limits of Air Cooling with Thermoelectrically Enhanced, Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.1, pp.679-684, 2004.
14. Ikeda, M.; Nakamura, T.; Kimura, Y.; Noda, H.; Sauciuc, I.; Erturk, H.,Thermal Performance of Thermoelectric Cooler (TEC) Integrated Heat Sink and Optimizing Structure for Low Acoustic Noise / Power Consumption, Semiconductor Thermal Measurement and Management Symposium, pp144-151, 2006.
15. Reiyu Chein, Thermoelectric cooler application in electronic cooling, Applied Thermal Engineering, Vol.24, pp.2207–2217, 2004.
16. B.J. Huang, System dynamic model and temperature control of a thermoelectric cooler, International Journal of Refrigeration, Vol.23, pp.197-207, 2000.
17. Tadayon, P., “Thermal Challenge During Micro- processor Testing,” Intel Tech. J., Q3, 2000.
18. Frank Kreith, Mark S. Boh “Principles of Heat Transfer 2001 Books/Cole”
19. Maidanik,Y.F.,Vershinin, Kholodov, V., and J. Dolgirev, “Heat Transfer Apparatus,” U.S. Patent No. 4515209, 1985
20. Yunus A. Cengel., 1998 “Heat Transfer”, McGraw-Hill.
21. Wei-Keng Lin, Bao-Shi Pei. “A Study on Heat Transfer Effect to the Trapezoid Grooved Heat Pipe in Micro Gravity (I)”, NSC 83- 0401- E007- 008.
22. Hung-Wen Lin, Yi-Xiang Zheng, Wei-Keng Lin, Tong-Bou Chang, "An Axial Heat Conduction Model to Predict the Maximum Heat Removed of the Miniature Heat Pipe", Transactions of the Aeronautical and Astronautical Society of the Republic of China, 35, No.4, pp393-400, 2003
23. Yao-Chen Chan, Hung-Wen Lin, Wei-Keng Lin,” Dynamic Tracing Method to Examine Maximum Heat Dissipate Ability of Heat-Pipe” 13th International Heat Pipe Conference (13th IHPC), pp311-316, 2004
24. 林鴻文,” 微型熱管系統散熱實驗與最大熱傳量之理論模式建立”,國立清華大學工程與系統科學系碩士論文,2003。
25. 洪佳煌,”熱管性能量測平台之靈敏度分析”,國立清華大學工程與系統科學研究所碩士論文,七月2008。
26. 林昆標,”熱電致冷器之三維暫態模擬分析”,國立成功大學機械工程學系碩士論文,2004。
27. 王威翔,”散熱器對熱電致冷器之性能影響”,國立交通大學機械工程學系碩士論文,2008。
28. 鄭憶湘,” 散熱片在強制對流下之最佳化設計與實驗”, 國立清華大學工程與系統科學研究所碩士論文,2002。
29. 盧俊彰,”影響熱管最大熱傳量之參數設計與分析”, 國立清華大學工程與系統科學研究所博士論文,2009。