薄膜材料是構成微轉換元件之基本結構，而如果能有效地得知其熱傳導性能，將會對於產品元件之熱傳特性與效能分析有很大的幫助，再者更會影響元件運作之壽命。而當薄膜材料之厚度尺寸縮小至微米或奈米等級時，其熱傳導係數值會與塊材材料有所不同，必須要利用適合此種薄膜特性之量測實驗架構，來將薄膜材料之熱傳導係數值求取出來。而本文將以量測金屬薄膜材料為主，來發展其適合的熱傳導性能量測方法，我們分別利用3ω method與熱脈衝法(heat pulse method)兩種實驗架構來嘗試量測出金屬薄膜之熱傳導係數值，並由實際量測過程中所得到之數據結果以及所遭遇之問題，來逐一探討這兩種實驗架構之可行性與準確性。

Thin film materials are basic components of micro solid-state devices. There will be a great contribution to efficiency and heat transfer characteristics of micro devices if we can understand the thermal conductivity properties of thin films efficiently. Furthermore, it will be related to lifetime of micro devices. When the dimension of thin film material shrunk down to micron or nano scale, the thermal conductivity of thin film will be different from its bulk material property. Hence, in past ten years recently, some reliable experimental techniques are developed to measure thermal conductivity of thin films. In this thesis, thermal conductivity of metal thin films are measured by 3ω method and heat pulse method, respectively. And this study evaluated the feasibility and accuracy of two experimental techniques from the problems and data results obtained in measurement steps.

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