研究生: |
張辰安 Cheng-An Chang |
---|---|
論文名稱: |
富錫區錫-銀-銅-鎳四元系統相平衡與固化性質 Phase equilibra and solidification properties of Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner |
指導教授: |
陳信文 博士
Sinn-Wen Chen |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
論文出版年: | 2004 |
畢業學年度: | 92 |
語文別: | 中文 |
論文頁數: | 87 |
中文關鍵詞: | 錫-銀-銅-鎳 、相平衡圖 、液相線投影圖 |
相關次數: | 點閱:1 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
Sn-Ag-Cu之共晶與近共晶合金是最熱門之無鉛銲料,Ni則是最常見的擴散障層材料。在迴焊與產品使用的過程中,Sn-Ag-Cu與Ni接觸與反應,形成了Sn-Ag-Cu-Ni之四元合金系統。Sn-Ag-Cu-Ni四元系統之等溫相平衡圖與液相線投影圖,對瞭解銲點之相生成及界面反應十分重要,然而現有文獻中並沒有相關之資料。本研究以實驗的方法,製備不同組成之富Sn合金,藉由熱處理、金相分析、組成分析、與X光繞射分析,最後配合實驗所得的結果與已知的Sn-Ag-Cu、Sn-Cu-Ni及Sn-Ag-Ni三元相平衡圖以及液相線投影圖,即可得到各種不同Sn濃度(高於60at%Sn)的等溫定Sn濃度的截面圖。最後將各層等溫、定Sn濃度的截面相圖結合起來,即可以得到由二維(Dimension)變三維的四元相圖。
在相平衡的部分Sn含量大於60at%之富Sn區域,並未觀察到新的四元介金屬相。先前之組成三元系統之研究已顯示並無新的三元介金屬相,因此在此區域內的生成相皆為含四元組成之端點固相溶液與二元之介金屬相。在Sn濃度為60at%相平衡圖中,可以見到較多的區域有Ag3Sn相之析出,在此組成下可以發現較大的Ag3Sn +Cu6Sn5+ Ni3Sn4+Sn(L)四相共存區域。
在液相線投影部分,在定Sn組成為95at%Sn、90at%Sn、80at% Sn及70at%Sn之組成下,其第一析出相主要為Cu6Sn5、Ni3Sn4、Cu3Sn、Ni3Sn2及Sn。當Sn的組成降至80at%時,Sn就沒有在以第一析出相的形式生成。而隨著Sn的濃度下降,Ni3Sn2所佔的比例也會逐漸增加,而Ni3Sn4及Sn的區域則是隨著濃度的下降逐漸縮小。
第六章、參考文獻
1. R. J. Klein Wassink, “Soldering in Electronics”, Electrochemical Publications, British Isles, 1989.
2. 陳朝光,“特殊銲接-軟銲”,熔接大意,第四章,pp.131 (1978)
3. J. Glazer, International Materials Review, Vol. 40(2), pp.63-95, (1995).
4. E. Bastow, Advanced Materials & Processes, Vol. 161(12), pp. 26-29, (2003).
5. A. Zribi, A. Clark, L. Zavalij, P. Borgesen, and E.J. Cotts, Journal of Electronic Materials, Vol.30, No. 6, pp.1157-1164 (2001)
6. C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, Journal of Electronic Materials, Vol. 31, No.6, pp. 584-590 (2002)
7. M. Abtew and G. Selvaduray, Materials Science and Engineering, Vol. 27, pp. 95-141, (2000)
8. J. W. Morris, Jr., J. L. F. Goldstein and Z. Mei, JOM, Vol. 45, pp. 25-27(1993).
9. S. W. Chen, Materials Chemistry and Physics, Vol. 33, pp. 271-276(1993).
10. W. J. Plumbridge, Journal of Materials Science, Vol. 31, pp. 2501-2514, (1996)
11. 陳信文,”無鉛銲料簡介”,電子材料,第1期,pp. 74-77,(1999)
12. 陳志銘、陳信文,”銲料與界面反應”,材料會訊,Vol. 6(2),pp.74-80,(1999)
13. J. S. Huang, SMT, Vol. 15(3), pp. 60-70, (2001)
14. I. Ohnuma, M. Miyashita, K. Anzai, X. J. Liu, H. Ohtani, R. Kainuma, and K. Ishida, Journal of Electronic Materials, Vol. 29 (10), pp. 1137-1144, (2000).
15. Official Journal of the European Union, pp, L 37/19~L 37/23, 13.2.2003.
16. “Roadmap 2002 for Commercialization of Lead-free Solder”, Official version 2.1, September 2002, Lead-Free Soldering Roadmap Committee, Technical Standardization Committee on Electronics Assembly Technology. JEITA.
17. K. Yokomine, N. Shimizu, Y. Miyamoto, Y. Iwata, D. Love, and K. Newman, 51th Electronic Components & Technology Conference (ECTC), May 30-June 2, pp. 1384-1392, (2001).
18. J.-K. Lin, A. De Silva, D. Frear, Y. Guo, J.-W. Jang, L. Li, D. Mitchell, B. Yeung and C. Zhagn, 2001 Electronic Components & Technology Conference, IEEE, pp. 455-462, (2001).
19. Y.-D. Jeon, S. Nieland, A. Ostmann, H. Reichl, and K.-W. Paik, Journal of Electronic Materials, Vol. 32(6), pp. 548-557, (2003).
20. K.-S. Kim, M. Haga, and K. Suganuma, Journal of Electronic Materials, Vol. 32(12), pp. 1483-1489, (2003).
21. M. E. Loomans, M. E. Fine, K. Suganuma, Metall. Mater. Trans. A, 31A(4), pp. 1155-1162
22. 黃新鉗,“IC構裝發展趨勢”,表面黏著技術,Vol. 28, pp. 10 (1999)
23. T.M. Korphonen, P. Su, S.J. Hong, Korphonen, and C.-Y. Li, J. of electronic M.A materials, Vol. 29, No 10 (2000)
24. 陳信文、許秀鳳、吳蒔涵、李守維,電子材料,第19期,pp. 132-139 (2003)
25. C.-H. Lin, S.-W. Chen, and C.-H. Wang, . Journal. of electronic materials, Vol. 31, No 9, p907-915(2002)
26. H.-F. Hsu, S.-W. Chen, Journal of Electronic Materials, (In print), (2003).
27. S.-W. Chen and Y.-W. Yen, Journal of Electronic Materials, Vol. 31, No 9, pp.1203-1208, (1999)
28. Y. A. Chang, D. Goldberg and J. P. Neumann, J. Phys. Chem. Ref. Data, Vol. 6-3, pp. 621-624, (1977)
29. H.-T. Luo and S.-W. Chen, J. Materials Science, Vol. 31(19), pp. 5059-5067, (1996).
30. C. R. Kao, JOM, Vol. 54, pg. 44 (2002).
31. F. N. Rhines, Phase Diagrams in Metallurgy their develop and application, Chap. 19 ,pp.220-272
32. I. Karakaya and W. T. Thompson, Binary Alloy Phase Diagrams, 1, 94-97(1991).
33. P. Nash and A. Nash, ASM Hankbook Vol.3 Alloy Phase Diagrams, ed. By H. Baker, ASM International, Materials Park, Ohio(1992).
34. N. Saunders and A. P. Miodownik, Bulletin of Alloy Phase Diagrams, Vol. 11, No. 3, pp.278-287, (1990).
35. W.C. Giessen, Bulletin of Alloy Phase Diagrams, Vol. 1, pp. 41-45 (1980).
36. D. J. Chakrabarti, D. E. Laughlin, S.-W. Chen and Y. A. Chang, “Phase Diagrams of Binary Nickel Alloys”, edited by P. Nash, ASM, Materials Park, pp. 85-95, (1991).
37. M. Singleton and P. Nash, ASM Hankbook Vol.3 Alloy Phase Diagrams, ed. By H. Baker, ASM International, Materials Park, Ohio(1992).
38. E. Wachtel and E. Bayer, Zeitschrift fur Metalllunde, Vol. 75, No. 1, pp. 61-69, (1984).
39. B. J. Lee, N. M. Hawang, and H. M. Lee, Acta Metallurgica et Materialia, Vol. 45, pp. 1876-1874, (1994)
40. H. M. Lee, S. W. Yoon, and B. J. Lee, Journal of Electronic Materials, Vol. 27, pp.1161-1166, (1998)
41. E. Gebhardt, and G. Petzow, Zeitschrift fur Metallkunde, Bd. 50, pp. 597-605, (1959)
42. K. P. Gupta, Indian Institute of Metals, Vol. 1, pp. 195-218(1990)
43. C. M. Miller, I. E. Anderson and J.F. Smith, Journal of Electronic Materials, Vol.23, pp.595-600(1994)