本論文應用壓印技術在軟性基板聚醯亞胺上實現低通濾波器，首先用模擬軟體ADS（Advanced design system）決定模具的圖樣，再將金屬濺鍍上模具，接著以壓印的方法將模具上的金屬圖樣黏附於聚醯亞胺上，並討論模具及聚醯亞胺的處理，與各種製程條件對壓印結果產生的影響。
由實驗結果得知，在模具上預先蒸鍍F13TCS（脫膜劑）以及對聚醯亞胺浸泡NaOH溶液進行基底處理皆可增加壓印圖樣的完整度。本實驗中，可以利用傳統微影製程製作而成的模具，藉由壓印的方式實現低通濾波器。
在低通濾波器的頻率響應方面，量測結果具有衰減高於截止頻率的訊號強度的特性，加上避免傳統被動元件大尺寸的困擾以及在軟性基板製作，提昇低通濾波器可攜性的可能性。

In this thesis, we fabricate low pass filter on flexible substrate, polyimide, by imprint technology. First, we use advanced design system to decide length and width of pattern on Si mold, then sputter metal on mold and imprint metal on polyimide. We will discuss the factors that influence imprint results, including surface treatment, and parameters of the imprint process.
As the result of this experiment, pre-coating F13TCS on mold and doing wet treatment to polyimide with strong NaOH solution can improve the imprint. At last, we imprint low pass filter on polyimide successfully by the mold that made with traditional lithography technology.
As the results of measurement, the low pass filters attenuate the signal level when the frequency of signal is higher than the cutoff frequency. We make the portability of low pass filter more possibilities, because we avoid large size of traditional passive components and we make low pass filter on flexible substrate.

[1] ITRS, International Technology Roadmap for semiconductors Conference（2005）
[2] Günter Schmid, Hagen Klauk, Marcus Halik, Ute Zschieschang, Florian Eder and Christine Dehm, “Polymer Electronics”, mstnews S/03, pp. 19-20（2003）
[3] L Jay Guo, J. Phys. D, Appl. Phys. 37 R123（2004）
[4] L. Montelius, Microelectronic Eng. 61-62,441（2002）
[5] The Properties of Polyimide Targets, LLE Review. Vol.92（2002）
[6] Stephen Y. Chou, Peter R. Krauss, and Preston J. Renstrom, Appl. Phys. Lett.67 , 3114（1995）
[7] Stephen Y. Chou, Peter R. Krauss, and Preston J. Renstrom, Science, 272, 85（1996）
[8] Stephen Y. Chou, Peter R. Krauss, and Preston J. Renstrom, J. Vac.Sci.Technol. B 14, 4129（1996）
[9] H. C. Scheer, H Schulz, T, Hoffman, and C. M. Sotomayor Torres, J. Vac. Sci. Technol. 16, 3917（1998）
[10] M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M. Wedlake, T. Michaelson, S. V. Sreenivasan, J. Ekerdt, C. G. Willson, Proc. of SPIE 3676 379（1999）
[11] Y. Xia, G. M. Whitesides, Angew. Chem. Int., 37, 500（1998）
[12] X. D. Huang, L.-R. Bao, X. Cheng, L. J. Guo, S. W. Pang, and A. F. Yee, Reversal imprinting by transferring polymer from mold to substrate, Journal Vacuum Science Technology B, Vol.20(6), pp. 2872-2876（2002）
[13] X. D. Huang, L. R. Bao, X. Cheng, L. J. Guo, S. W. Pang, and A. F. Yee, J. Vac. Sci. Technol. B 20, 2872（2002）
[14] 金進興, 工業材料, 六月, 114（1996）
[15] David M. Pozar, Microwave Engineering, 3rd Editon, John Wiley & Sons, Inc（2005）
[16] Dieter K. Schroder, Semiconductor Material and Device Characterization, 2nd Edition, John Wiley & Sons, Inc（1998）
[17] M. Beck, M. Graczyk, I. Maximov, E. L. Sarwe, T. G. I. Ling, M. Keil, L. Montelius, Microelectronic Engineering, 61-62, 441（2002）
[18] T. Nishino, M. Meguro, K. Nakamae, M. Matsushita, and Y. Ueda, Langmuir 15, 4321（1999）
[19] Jem-Kun Chen, Fu-Hsiang Ko, Kuen-Fong Hsieh, Cheng-Tung Chou, Feng-Chih Chang, J. Vac. Sci. Technol. B 22, 3233（2004）
[20] T. R. Shen, Study of wet treatment of polyimide by sum-frequency vibrational spectroscopy, Appl. Phys. Vol.74, 22（1999）