近年來，光學微機電(optical MEMS)技術利用半導體製程，以及其他相關微機械加工製程技術，已發展出各式高精度、光學品質之元件，如微光開關、光衰減器、以及顯示器等。對一個可動系統而言，傳統的製造技術乃利用精密加工，分別製作出致動器、傳動器、連接器、以及被動元件等，最後透過精密的組裝(assembly)技術，便可完成運作系統；然而，利用光學微機電技術來設計元件時，元件製造是藉由半導體製程所定義，屬於平面加工製程(planner fabrication)，系
統所需的元件同時於半導體製程中完成，對於系統積體化(integration)有非常大的幫助，然而，平面加工的製造方式也導致了設計與製造的相關性，設計者必須考量製程的特性，選用適合元件的製程，而製程也必須提供多樣性來滿足設計者。因此，針對設計與製造密不可分的關連性，開發包含最多可能性之通用製程平台技術，將有其必要性，特別是製程能否提供設計者在結構厚度與垂直深度上的變化性，將是能否發揮設計巧思與創意的關鍵。本研究以目前最通用之多晶矽薄膜製程技術為出發，研究多晶矽薄膜製程所遭遇之問題，如光學平坦度與薄膜結構剛性等；進而針對這些問題，開始設計整合其他微加工製程，如體蝕刻製程(bulk micromachining)與深蝕刻製程(DRIE)等，一方面透過製程設計來增加薄膜之結構剛性，另一方面並利用體蝕刻製程之晶格面變化，企圖設計出整合性平台製程技
術，利用製程在結構厚度與垂直深度上的變化性，建立光學微機電之通用製程平台。除了製程設計外，本研究也將利用所提出之製程，針對微掃描面鏡在光學平坦度與驅動機制，設計肋強化結構與大位移之靜電式垂直梳狀致動器，以發展大角度、高共振頻率、低驅動電壓之微掃描面鏡。最後，透過微掃描面鏡之性能測試，將展示通用型製程平台技術的性能特色與可行性。

Optical Microelectromechanical systems (MEMS) have recently emerged as a powerful means of implementing such functions in compact and low-cost form, owing to the unique capability of this technology to integrate optical, mechanical, and electrical components on a single wafer. Various optical MEMS components, such as laser printer, display, and optical cross connects, have been demonstrated. However, how to used planar fabrication for commercialized optical MEMS device is one of key challenges. This work integrated two-poly MUMP’s process, multi-depth DRIE etching and bulk micromachining to accomplish superior poly-Si micro-optical systems. The thickness and depth-difference of the devices was significantly increased using the trench-refilled structure. In addition, the space between the devices and the substrate was remarkably increased to ~100µm by bulk silicon etching. Moreover, the self-aligned vertical comb actuators were available through the multi-depth DRIE etching for high performance out-pf-plane actuator. In applications, he scanning mirrors driven by self-aligned vertical comb actuator were demonstrated. These multi-depth optical devices can further integrate with the MUMP’s devices to establish a more powerful MOEMS platform.

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