本研究以聚亞醯胺(polyimide, PI)為基材，利用反應型改質劑，如帶有八個甲基丙烯酸甲酯官能基的多面體低聚倍半矽氧烷(MMA-POSS)、帶有一個甲基丙烯酸甲酯官能基和七個異丁基的多面體低聚倍半矽氧烷(MAI-POSS)、以及含有雙氧代氮代苯并環己烷(benzoxazine)官能基的橋式聚倍半矽氧烷單體(BPA-APTES-Bz)等，探討添加此等改質劑對於聚亞醯胺高分子之介電常數的影響。將以上三種改質劑分別直接與聚醯胺酸溶液摻混，經塗佈成膜後以熱環化方式製備聚亞醯胺複合材料。於MMA-POSS添加比例為10 wt%時，聚亞醯胺薄膜的拉伸強度由原來的161 MPa上升至224 MPa，補強效果提升了34 %；於MAI-POSS添加比例達15 wt%時，薄膜拉伸強度由161 MPa上升至189 MPa，補強效果提升17 %。介電常數部分，在頻率為5 GHz時，純聚亞醯胺之介電常數為3.6左右，於MMA-POSS摻混比例為15 wt%時，其介電常數降至3.35，而添加MAI-POSS之摻混比例為15 wt%時，介電常數則降至3.09，此外，BPA-APTES-Bz之摻混比例為20 wt%時，聚亞醯胺複合膜的介電常數則降至3.11。以上結果顯示三種改質劑皆能以簡單容易的操作方法來製備低介電的聚亞醯胺複合材料，並能發揮補強作用，有效地提高其機械強度。

Polyimides have been modified with reactive additives, including methylmethacrylate POSS (MMA-POSS), methacrylisobutyl POSS (MAI-POSS) and benzoxazine-bridged bis(trialkoxysilne) compound (BPA-APTES-Bz), to reduce the dielectric constants and increase the mechanical strength of polyimides.The MMA-POSS/PI composite film with 10 wt% MMA-POSS exhibits a 34 % increase in tensile strength and the MAI-POSS/PI composite film with 15 wt% MAI-POSS exhibits a 17 % increase in tensile strength, compared to with the neat PI sample. Addition of the POSS additives significantly decreases the dielectric constants (Dk) of the PI samples. At 5 GHz, the Dk values drop from 3.6 to 3.35 with PI composites having 15 wt% of MMA-POSS and to 3.09 with PI composites having 15 wt% of MAI-POSS. Moreover, the Dk value of the PI sample with 20 wt% of BPA-APTES-Bz is 3.11. A simple and effective approach to prepare low-Dk PI composite films has been developed.

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