在現今通訊網路的快速發展下，操作於毫米波頻段的通訊技術成為未來重要的研究趨勢。由於高頻段資源豐富，能夠提供大量系統容量，因此擁有更快的速度、更大的頻寬與更低的延遲。毫米波主要的應用包括車輛雷達感測、行動裝置和收發基地台等。但毫米波的波長短，繞射能力差導致傳輸距離受到限制。為了做到完整網路覆蓋，矽光子光載毫米波通訊系統提供有效的解決辦法，此技術也是本論文的核心內容。論文架構主要分為晶片設計和系統整合兩大主題來進行介紹。
本論文將介紹三個操作於Ka-band的毫米波晶片，分別應用於光載毫米波系統的傳輸端與接收端，並利用90-nm CMOS製程來實現，該製程擁有高整合度與低功耗的優點。第一個晶片設計為低雜訊放大器，用來做為在接收端馬赫-曾德爾干涉儀 (Mach Zehnder Modulator, MZM)的驅動晶片。由於為在接收端馬赫-曾德爾干涉儀需求，該放大器利用分路器將訊號變成雙端輸出，並分別擁有11.5 dB和13.2 dB的線性增益，其雜訊指數為2.5 dB。第二個晶片設計為第一個晶片的延續，在架構中增加功率放大器來對輸出功率進行最大化，進而能更穩定的驅動MZM。第三個晶片設計則是用來做為傳輸端轉換並放大訊號的角色，接收來自光電二極體的電流訊號，將之轉換成電壓訊號並由PA放大。該晶片擁有37.32 dB的線性增益，其雜訊指數為4 dB，並擁有約14 dBm的飽和輸出功率。
本論文第二部分將介紹傳輸端系統整合，將晶片三與光二極體整合在PCB板上。透過單頻訊號傳輸、OFDM調變訊號傳輸與電視訊號傳輸來驗證該系統整合設計成功。另外，本論文亦將介紹1x4的陣列天線的設計，將光載毫米波應用於無線傳輸系統。

Under the rapid development of communication network in modern days, technique that operates in millimeter wave band became the most important research area. Due to the abundant resources in high frequency band, it can provide massive system capacity, which brings us faster transmission rate, wider bandwidth and lower latency. The main applications of millimeter wave include automotive radar, mobile devices and transceiver communication station. But the wavelength of millimeter-wave is too short, and the diffraction is too weak which limited the transmission distance. In order to cover the network completely, Radio-over-Fiber (RoF) system provides an efficient solution, which is the core content of this theory. The thesis structure can simply divide into two subject, chip design and system integration.
In this thesis, three millimeter-wave circuits that operate in Ka-band for RoF systems will be presented. They are fabricated in a 90-nm CMOS process. The process has advantages of high integration and low power dissipation. The first design is low-noise amplifier, which is used for driving Mach Zehnder Modulator (MZM) in RoF receiver. According to the requirements of the MZM, a splitter is used to generate two output signals. They have 11.5 dB and 13.25 dB power gain, respectively, and 2.5 dB noise figure. The second design is the extended version of the first chip with a power amplifier added to maximum the output power, in order to drive the MZM more stably. The third design is used in RoF TX system. It receives the current signals from photo diode (PD), and converts them into voltage signals then amplified by them. This chip has 37.32 dB power gain, 4 dB noise figure and 14 dBm saturation output power.
In the second part of this thesis, the transmitter (TX) RoF integration is presented. The integration includes the integrated circuits and the PD on a printed circuit board (PCB). Through a single tone testing, OFDM modulated signal testing and TV HDMI signal testing, we can verify the functionality of the integrated transmitter. Furthermore, we will introduce 1x4 patch antenna design, which is the critical device that allows RoF system to become the true wireless communication system.

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