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研究生: 鄭皓元
Cheng, Hao-Yuan
論文名稱: 二硫化鎢鐵電場效電晶體及其記憶體特性
WS2 Ferroelectric Field­-Effect Transistors and Its Memory Characteristics
指導教授: 邱博文
Chiu, Po-Wen
口試委員: 巫勇賢
Wu, Yung-Hsien
李奎毅
Lee, Kuei-Yi
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電子工程研究所
Institute of Electronics Engineering
論文出版年: 2021
畢業學年度: 110
語文別: 中文
論文頁數: 75
中文關鍵詞: 二維材料二硫化鎢鐵電材料記憶體
外文關鍵詞: 2D material, Tungsten disulfide, Ferroelectric material, Memory
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  • 本論文透過利用低壓化學氣相沉積法製備單層的二硫化鎢當作鐵電場效電晶體的通道材料,並且利用鐵電材料取代傳統的閘極介電層,做成一元件,並探討它們的鐵電特性以及量測其電性與記憶體特性。元件製作是利用乾式轉印技術將低壓化學氣相沉積法成長之二維材料以及鐵電材料利用自行配製的PDMS搭配乾式轉印機台將材料轉移至目標位置,論文中也利用兩種不同的鐵電材料進行元件的製作,分別是HZO以及CIPS,HZO的製備是與清華大學工科所巫勇賢實驗室的同學進行合作所得到,透過調整成長參數,藉此量測到其鐵電特性,量測時會先利用PUND的量測方法測試其各自的鐵電特性,最後利用電流公式去計算出它們的極化值,此量測能夠觀察到鐵電材料的反轉電壓值以及其反轉電流大小,並利用這些條件進行後的記憶體特性量測,CIPS則是透過機械剝離法轉印至矽基板上,同樣利用乾式轉印技術將二硫化鎢對準到其上方,做成一元件進行相同的電性量測以及記憶體特性量測。


    This thesis uses low pressure chemical vapor deposition (LPCVD) to fabricate a monolayer WS2 as the channel material for ferroelectric field-effect transistors (FeFET), and uses ferroelectric materials to replace the traditional gate dielectric layer to make a device and discuss for the ferroelectric characteristics. And also have its electrical and memory characteristics measurement.Device use dry transfer method to transfer the WS2 grown by low pressure chemical vapor deposition and ferroelectric materials to the target position using PDMS with a dry transfer machine. And also uses two different ferroelectric materials for the device ,called HZO and CIPS.The preparation of the HZO cooperate with professor Wu's laboratory of the Institute of Engineering of National Tsing Hua University. By adjusting the growth parameters, the ferroelectricity can be measured. During the measurement, the PUND test will be used to measure their ferroelectricity , and finally the current formula will be used to calculate their polarization value. This measurement can observe the switching voltage value and the switching current of the ferroelectric material. And also use this condition to do the memory characteristic measurement. CIPS is transferred to the silicon substrate by the mechanical exfoliate method, and the WS2 is aligned on top of the CIPS by using dry transfer method to make the device.And also have the electrical measurement and memory characteristic measurement.

    第1章 緒論.............................................1 1.1 半導體技術發展史......................................1 1.2 半導體製程之微縮與限制................................3 1.3 半導體記憶體之介紹....................................5 1.4 論文架構............................................10 第2章 二維材料及鐵電材料之介紹.........................11 2.1 二維材料發展........................................11 2.2 鐵電材料之介紹..................................... 13 2.3 過渡金屬二硫化物之晶格結構...................... 16 2.4 過渡金屬二硫化物之電子能帶...................... 17 第3 章 二維材料之成長與檢測........................... 19 3.1 二維材料製備之方法................................. 19 3.1.1 機械剝離法(Mechanical exfoliation) ............. 19 3.1.2 化學氣相沉積法(Chemical vapor deposition)........ 19 3.2 化學氣相沉積法製備二硫化鎢.......................... 20 3.2.1 製程設備......................................... 20 3.2.2 製程與參數....................................... 20 3.3 二維材料檢測方法.................................... 23 3.3.1 拉曼散射光譜之檢測................................ 23 3.3.2 光致發光光譜之檢測................................ 25 3.4 鐵電材料製備方法.................................... 27 第4 章 元件製程......................................... 30 4.1 元件結構............................................ 30 4.2 基板清洗............................................ 30 4.3 二維材料之成長...................................... 31 4.4 乾式轉印技術........................................ 32 4.4.1 二維材料轉印流程................................... 33 4.4.2 鐵電材料轉印...................................... 36 4.5 黃光微影製程........................................ 39 4.6 反應離子蝕刻........................................ 40 4.7 熱蒸鍍金屬.......................................... 41 第5 章 實驗量測結果之分析與討論........................... 43 5.1 元件量測系統........................................ 43 5.2 元件量測方法........................................ 44 5.3 元件量測結果分析.................................... 45 5.3.1 鐵電材料之鐵電特性量測............................. 45 5.3.2 鐵電場效電晶體之量測與記憶體特性分析................ 56 第6 章 未來展望......................................... 73 參考文獻............................................... 74

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