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研究生： 李英舜
In-Shung Lee
論文名稱： 塑封球柵陣列電子構裝之破裂延伸
Crack Propagation in Plastic Ball Grid Array Electronic Packaging
指導教授： 葉孟考
Meng-Kao Yeh
口試委員:
學位類別： 碩士
Master
系所名稱： 工學院 - 動力機械工程學系
Department of Power Mechanical Engineering
論文出版年： 2000
畢業學年度： 88
語文別： 中文
論文頁數： 100
中文關鍵詞： 塑封球柵陣列電子構裝 、迴焊 、脫層 、應力強度因子 、能量釋放率
外文關鍵詞： PBGA, reflow, delamination, stress intenstive factor, energy release rate
相關次數： 點閱：3  下載：0 
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    • 塑封球柵陣列電子構裝（Plastic Ball Grid Array, PBGA）經過吸濕及迴焊加熱過程可因封裝內部各材料之熱膨脹係數的差異及所吸收之濕氣因昇溫而轉換成蒸氣所形成之蒸氣壓造成界面脫層。文中利用ANSYS軟體進行數值模擬，使用均質且不隨溫度改變之材料特性，求出PBGA內部在迴焊過程中裂縫尖端附近之應力強度因子及應變能釋放率，以分析其可能之延伸方向，並配合實驗，驗證模擬分析之可靠性。
    本文對兩種不同結構之PBGA其內部裂縫提出了可能延伸之方向，結果發現PBGA內部最容易產生脫成裂縫之位置為晶片座邊緣角落及晶片中心之晶片黏著層/晶片座接合介面；由溼熱實驗配合數值分析得到PBGA電子構裝內部最易產生之裂縫成長型態為裂縫由晶片黏著層/晶片座接合介面中心開始，沿著介面成長至封膠/晶片座介面，再沿著封膠/基板介面成長至構裝體表面；且改變迴焊溫度，對構裝體內部結構介面間之應力值和裂縫尖端之能量釋放率有相當程度之影響。

    摘要………………………………………………………………… I 致謝………………………………………………………………… II 目錄………………………………………………………………… III 圖表目錄…………………………………………………………… V 符號說明…………………………………………………………… XI 第一章 簡介……………………………………………………… 1 1.1 研究動機………………………………………… 1 1.2 文獻回顧………………………………………… 2 1.3 研究主題………………………………………… 5 第二章 有限單元分析…………………………………………… 6 2.1 單元選取………………………………………… 6 2.2 熱分析…………………………………………… 7 2.3 熱應力…………………………………………… 8 2.4 介面脫層之應力強度因子……………………… 9 2.5 單一材質裂縫之應力強度因子………………… 11 第三章 實驗程序………………………………………………… 13 3.1 實驗設備………………………………………… 13 3.1.1 C-Scan超音波檢測系統……………………… 13 3.1.2恆溫恆濕機…………………………………… 13 3.1.3熱風循環式烤箱……………………………… 13 3.1.4電子天平………………………………………… 14 3.1.5鑽石切割機……………………………………… 14 3.1.6拋光研磨機……………………………………… 14 3.1.7電腦顯微放大系統……………………………… 14 3.2 溫濕度實驗……………………………………… 15 第四章 結果與討論……………………………………………… 16 4.1 數值驗證及收斂性……………………………… 16 4.2不含脫層裂縫PBGA結構分析……………………… 17 4.2.1 PBGA模型一應力分析………………………… 17 4.2.2 PBGA模型二應力分析………………………… 18 4.2.3破壞起始位置預測……………………………… 19 4.3 PBGA模型一之脫層裂縫成長分析……………… 19 4.3.1起始點1之裂縫成長分析……………………… 19 4.3.2起始點3之裂縫成長分析……………………… 21 4.4 PBGA模型二之裂縫成長分析…………………… 23 4.5溫濕實驗結果……………………………………… 25 4.6 PBGA模型一250℃負載之分析…………………… 26 4.7 PBGA分析模型之修正…………………………… 26 第五章 結論……………………………………………………… 27 參考文獻…………………………………………………………… 28 圖表………………………………………………………………… 34

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