研究生: |
楊卓遠 |
---|---|
論文名稱: |
基於深度感測技術之即時性虛實組裝 Real-Time Product Assembly Evaluation in Augmented Reality using Depth Sensing Technologies |
指導教授: | 瞿志行 |
口試委員: |
羅承浤
孫天龍 林永裔 |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 工業工程與工程管理學系 Department of Industrial Engineering and Engineering Management |
論文出版年: | 2013 |
畢業學年度: | 101 |
語文別: | 中文 |
論文頁數: | 71 |
中文關鍵詞: | 深度攝影機 、虛實組裝 、擴增實境 、設計評估 |
相關次數: | 點閱:2 下載:0 |
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本研究透過深度攝影機取得三維場景資訊,將虛擬模型組裝於使用者選取之真實物件上。藉由虛實組裝結果的呈現,在完整產品原型未完成前,即可進行設計評估。根據使用者提供的組裝特徵資訊,由場景取得的幾何及影像資訊中,自動進行特徵的無標記辨識與追蹤,透過面貼合與軸對稱兩種常用的組裝關係,準確定位真實影像與幾何模型,輔助進行分散式協同組裝。此外發展兩項全新的即時性評估技術:「截面切割顯示」與「組裝干涉檢查」,以量化的方式檢驗組裝相容性。為克服單一攝影機視角的限制,透過場景校正功能整合多台深度攝影機,以取得更完整的場景資訊,提供高品質的擴充實境互動經驗。本研究開啟深度攝影機於動作擷取之外,在產品設計上的創新性應用。
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