本研究採用動態刀刃法搭配荷重元分析晶圓對的接合界面能及刀刃背後荷重(局部接合力)，探討界面能及刀刃荷重與試片尺寸之相關特性，以及經不同壓力均勻施壓製作之親、斥水性晶圓對，界面能及荷重的一致性。同時嘗試以微波加熱的方式，於短時間內，提升晶圓對的界面能，並比較親、斥水性晶圓對熱癒合及微波癒合行為的差異。
完整晶圓對與不同寬度條狀試片有相近似的界面能，不隨試片寬度尺寸改變，而局部接合力則與試片寬度成正比。經奈米壓印系統施加不同壓力製作之親、斥水性晶圓對，界面能及刀刃荷重皆分別趨向一定值，不隨施壓壓力改變。
親、斥水性晶圓對界面能及刀刃荷重皆因退火處理而增強，且拉長退火時間有助於界面能及荷重的提升。推測晶圓對經長時間退火處理，界面縮合聚合反應發展較完全，有較高的界面能及刀刃荷重。親水性晶圓對微波處理5分鐘，可快速提升界面能，強度媲美大氣爐400℃，120小時退火處理的效果，而斥水性者無此情形。推測因親水性晶圓對界面含水分子受微波影響，快速離開接合界面，使界面產生大量的矽氧矽(Si-O-Si)共價鍵結，界面能快速提升。對接合界面上缺乏水分子的斥水性晶圓對而言，微波處理僅是加熱，與大氣爐退火處理應差異不大，故未能快速提升界面能。
經動態刀刃分析過之親水性晶圓對，施以高溫1000℃熱癒合處理，能使界面薄氧化矽層融成黏滯流，填補原先被刀刃劈開的裂口，界面能可恢復或超過刀刃分析前的強度。刀刃分析過之斥水性晶圓對經800℃較低溫熱癒合處理，就能使裂口癒合，推測是因接合界面矽原子擴散，填補原先被劈開的裂口，界面能可恢復或超過刀刃分析前的強度。運用微波處理，晶圓對表面溫度上升不到260℃，無法使刀刃分析過之晶圓對裂口癒合。

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