利用電化學沉積法與微米壓印法製作精細矽基太陽能電池導線研究

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研究生：	陳威霖 Chen, Wei-Lin
論文名稱：	利用電化學沉積法與微米壓印法製作精細矽基太陽能電池導線研究 Fine-line Metallization of Silicon-based Solar Cells by Electrochemical Deposition and Microcontact Printing
指導教授：	陳力俊 Chen, Lih-Juann 萬其超 Wan, Chi-Chao
口試委員:	陳力俊 Chen, Lih-Juann 萬其超 Wan, Chi-Chao 林景熙
學位類別：	碩士 Master
系所名稱：	工學院 - 材料科學工程學系 Materials Science and Engineering
論文出版年：	2011
畢業學年度：	99
語文別：	英文
論文頁數：	116
中文關鍵詞：	壓印、電化學沉積
外文關鍵詞：	Printing, Electrochemical Deposition
相關次數：	點閱：2 下載：0
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A new process to produce rapidly a two-layer (Ni3P/Cu) structure as front-side conductor of textured mono-crystalline silicon solar cells has been developed. This new technique combines microcontact printing with electrochemical deposition. Microcontact printing is a simple and cost-effective method to create selective emitter patterns on silicon-based solar cells. Electrochemical depositions, including both electroless deposition of amorphous nickel–phosphorus (NiP) and electroplated copper (Cu), offer a low-cost process relative to the conventional silver-paste technology.
The first step is to imprint Pd ink on the front side of solar cells by microcontact printing, which provides an activation layer. The second step is electroless deposition of NiP film. After annealing the NiP film at 400 ˚C in N2 furnace for ten min, Cu layer is deposited to increase line conductivity. A NiSi phase is formed between the NiP film and silicon substrate. The crystallization of amorphous NiP film was confirmed by an increase in Ni3P peaks in XRD spectra.
The contacts formed on Si in the as-deposited NiP films are ohmic with a contact resistivity of about 10−4 Ωcm2. which is better than the conventional silver-paste contacts (10−3 Ωcm2). The width of finger by microcontact printing is less than 40 μm. Furthermore, the substrates being lightly POCl3 doped with a sheet resistance of 80 Ω/□ gain in short-wavelength response and decrease the surface recombination, contact resistance, surface recombination velocity as well as emitter area, thus resulting in improved performance of cells. Microimprinting can increase not only cell efficiency but also module power. Compared with conventional solar cell without antireflection coating, the improvement in solar cell efficiency by more than ~1% can be achieved. The results indicate that this technique has potential applications in solar cell fabrication.

本研究開發出一種新的快速製作出兩層結構(Ni3P/Cu)當作單晶太陽能電池上電極。這種新的技術包含了電化學沉積法和微米壓印法，微米壓印法是一種快速低成本方法而用於在矽基太陽能電池上製作出選擇性的電極。此外電化學沉積法用於了兩部分，其一是無電鍍鎳另一則是電鍍銅，此技術提供一種有別於以往的傳統銀膠的低成本材料製程。
首先，利用微米壓印技術壓印鈀奈米粒子於太陽能電池上半部，目的為利用鈀的催化活性。第二步無電鍍上非晶相的鎳磷層之後在氮爐中以400 ˚C十分鐘退火，最後電鍍銅以增加線傳導性，NiSi相形成在Ni3P與矽基板之間。非晶相的鎳磷層藉由XRD顯示出的Ni3P峰值以確認。
在矽與鎳磷層之間的接觸電阻值約為10−4 Ωcm2 ，此值優於傳統的銀膠(10−3 Ωcm2)。微米壓印的線寬可低於40 μm。此外基板擴散POCl3 摻雜片阻值為80 Ω/□, 輕摻雜的好處為增加短波長光線的吸收並降低表面的復合。總結此研究降低了接觸電阻，降低了表面復合速率，降低了電極的表面積，導致了電池效率的增長。微米壓印這項技術不僅增進了效率也增進了模組的功率，效率的增進約為1% 結果顯示，該技術具有潛在的應用在太陽能電池製造。

Chapter 1 Introduction and Literature Review............1
1-1 Introduction .......................................1
1-2 Configuration and Operation Principle...............2
1-3 The Strategies for Achieving Nanowires and Growth
    Mechanism...........................................5
1-4 Loss Mechanism due to Front Side Metallization
    Pattern .......................................... 10
1-4.1 Optical Losses.................................. 11
1-4.2 Recombination Losses............................ 14
      Radiative Recombination..........................15
      Auger Recombination..............................15
      Recombination through Impurity Centers and
      Crystal Defects in Bulk..........................16
      Recombination at the Surface.....................16
1-4.3 Electrical Losses ...............................17
1-5 Metallization on Front-side Silicon-based Solar
    Cell.............................................. 20
1-5.1 Screen Printing .................................22
      The Metallization Process by Screen Printing.....22
      Metal Contact Formation Process by Screen-printed
      Silver Paste.....................................24
      All Possible Current Paths for Plated Contact....32
1-5.2 Photolithography with Evaporation or Immersion...36
      Laser Irradiation................................37
      Ink-jet Printing.................................41
1-6 Motivation.........................................44
Chapter 2 Experimental Procedures......................45
2-1 Materials..........................................45
2-2 Microcontact Printing Solar Cell Manufacturing
    Process............................................47
2-2.1 Silicon Wafer....................................47
2-2.2 Surface Texturization............................47
2-2.3 POCl3 Diffusion..................................47
2-2.4 Back Side Screen Printing and Firing.............48
2-2.5 Laser Edge Isolation.............................51
2-3 Mold Manufacturing Procedure.......................51
2-4 Metallization Process..............................54
2-4.1 Preparation of Pd Nanoparticles for Activation...54
2-4.2 Microcontact Printing............................57
2-4.3 Deposition of NiP and Cu Films...................58
2-5 Measurement Methods................................59
2-5.1 Four Point Probe Measurement.....................58
2-5.2 UV Spectrometry..................................60
2-5.3 X-Ray Diffraction................................61
2.6 Processing Equipments..............................63
2-6.1 Chemical Tank....................................63
2-6.2 High-temp Diffusion Furnace and Plasma Enhanced
      Chemical Vapor Deposition System.................64
2-6.3 Electrode Reel-to-Reel Screen Printer............65
2-6.4 High-Temperature Firing Furnace..................66
2-6.5 Laser Etching System.............................67
Chapter 3 Results and Discussion.......................69
3.1 Activation with Pd Nanoparticles for Electroless
    Deposition of NiP..................................69
3-1.1 XRD Analysis.....................................71
3-1.2 TEM Analysis.....................................72
3.2 Electroless Deposition of NiP Thin Films...........73
3.3 Annealing Conditions for NiP Films.................80
3.4 Rc Measurement with TLM Model......................90
3.5 Cu Film by Electrodeposition.......................93
3.6 I-V Measurement....................................95
3.7 Simulation........................................100
Chapter 4 Summary and Conclusions.....................103
Chapter 5 Future Prospects............................105
Chapter 6 References..................................109

                                

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