本研究致力於晶圓級自動化檢測平台系統之建立。以LabVIEW程式製作之人機介面，將視覺辨識系統之實驗值、雷射位移感測器讀取的數值、晶圓移動平台之座標和目標座標整合在一起，並利用程式將晶圓位置與定位自動化。
商用半導體和微機電結構的量測系統分為固定式探針卡與通用型探針台，固定式探針卡，會因為結構不同而受到限制，不適合尚未量產的產品，通用型探針台不但依賴人工，也缺乏穩定性與重複性。在商業上無法達到需求，在未來也可能因為日益微小的結構造成對位上的困難。為了解決上述問題，本研究致力於開發自動化對準之晶圓級檢測系統，所建立之平台搭配視覺辨識系統、雷射位移感測器、自動化探針座系統、晶圓移動平台，以視覺辨識系統找出晶圓與晶圓移動平台的旋轉角度，以及定出新的座標，接著利用雷射位移感測器回授自動化探針系統之探針位置，對準晶圓以進行量測。此外本研究建立之平台亦可以透過整合不同功能的探針頭，進行多元化的量測行為，以符合自動化量測微機電晶圓之功能。

This thesis develops an automated wafer-level testing system, using visual and Laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners and laser sensors for probe positioning automated, wafer movable stage for the wafer positioning. With the LabVIEW based human-machine interface, the visual identification, the position feedback from laser sensor, the wafer movable stage and device coordinates on the wafer can be monitored during the measuring process. The LabVIEW-based program is implemented to achieve the automatic control of wafer positioning and measuring.
There are mainly two kinds of systems, probe card system and custom probing equipment, are utilized to measure commercial semiconductor and MEMS structures. Probe card system, which is limited by fixed structure, is not an appropriate approach to be used in developing stage. On the other hand, custom probing equipment, depending on manual operation, is short of stability and repeatability. The automated positioning wafer-level test platform developed in this work can solve the mentioned problem above.
Visual identification system is used to define the coordinate of devices and to fix the angle error between wafer and movable stage. Visual identification system can identify the center coordinate of a mark, and calculate the new coordinate and the angle error between the wafer and movable stage. The new coordinate of device can be thus calculated from two coordinates. Then the automated positioning system will drive the motorized micro positioner to the target position. Laser sensor is used as the feedback of the motorized micro positioner, which has ± 10 µm error in positioning. When the probes arrive above the target position, the micro positioner will lower the probes to the proper position to start the measurement. Compared with traditional measuring approach, this work offers a rapid and stable way to measure wafers.

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