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| 研究生： |
陳揚哲 Dave Y.C. Chen |
|---|---|
| 論文名稱： |
微環形殘餘應力感測器出平面挫曲變形與拉伸應力感測之研究 |
| 指導教授： |
陳榮順
R. Chen |
| 口試委員: | |
| 學位類別： |
碩士 Master |
| 系所名稱： |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
| 論文出版年： | 2004 |
| 畢業學年度： | 92 |
| 語文別： | 中文 |
| 論文頁數： | 57 |
| 中文關鍵詞： | 微機電 、殘餘應力 、薄膜 |
| 外文關鍵詞： | MEMS, Residual Stress, Thin Film |
| 相關次數： | 點閱：2 下載：0 |
| 分享至: |
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微機電系統乃是以半導體製程為平台，並結合了機械、電子、光學、材料等多種領域所發展出的新技術。在微機電元件製程中由於殘餘應力的影響，常造成結構出現不必要的變形，影響元件的性能，因此，量測應力數值作為製程參數的參考已有多人進行研究。本文將研究重心投注在微環形殘餘應力感測器的分析上，研究出平面方向變形對感測結果之影響，以改變元件尺寸的方式降低出平面變形的現象，進一步提高感測器量測的精確度。此外，本論文中提出一另類的設計，利用改變結構挫屈方向完全抑制垂直方向的變形。
[1] W. Fang and J.A. Wickert, “Determining mean and gradient residual stress in thin films using micromachined cantilevers,” J. Micromech. Microeng., Vol. 6, pp. 301-309, 1999.
[2] J. Hsieh and W. Fang, “A novel microelectrostatic torsional actuator,” Sensors and Actuators A, Vol. 79, pp. 64-70, 2000.
[3] R. T. Chen, H. Nguyen, and M.C. Wu, “A low voltage micro-machined optical switch by stress-induced bending,” Micro Electro Mechanical Systems MEMS '99, pp. 424-428, 1999.
[4] C. Tsou and W. Fang, “The effect of residual stresses on the deformation of semi-circular micromachined beams,” J. Micromech. Microeng., Vol. 10, pp. 43-41, 1999.
[5] C. Tsou, H. Yin, and W. Fang, “On the out-of-plane of v-shaped micromachined beams,” J. Micromech. Microeng., Vol. 11, pp. 153-160, 2001.
[6] H. Guckel, T. Randazzo, and D.W. Burns, “A simple technique for the determination of mechanical strain in thin films with application to polysilicon,” J. Appl. Phys., Vol. 57, No. 1, pp. 1671-1675, 1985.
[7] H. Guckel, D. Burns, C. Rutigliano, E. Lovell, and B. Choi, “Diagnostic micro structure for the measurement of intrinsic strain in thin films,” J. Micromech. Microeng., Vol. 2, pp. 86-95, 1992.
[8] L. Lin, A.P. Pisano, and R.T. Howe, “A micro strain gauge with mechanical amplifier,” Journal of Microelectromechanical Systems, Vol. 6, No. 4, pp. 313-321, 1997.
[9] C. Pan and W. Hsu, “A microstructure for in situ determination of residual strain,” Journal of Microelectromechanical System, Vol. 8, No. 2, pp. 200-207, June 1999.
[10] Y.B. Gianchandani and K. Najafi, “Bent-beam strain sensors,” Journal of Microelectromechanical Systems, Vol. 5, No. 1, pp. 52-58, 1996.
[11] L. Que, M.-H. Li, L.L. Chu, and Y.B. Gianchandani, “A micromachines strain sensor with differential capacitive readout,” Micro Electro Mechanical Systems MEMS '99, pp. 552-557, 1999.
[12] S. Seok, B. Lee, and K. Chun, “New electrical residual stress characterization using bent beam actuators,” J. Micromech. Microeng., Vol. 12, pp. 562-566, 2002.
[13] L. Elbrecht, U. Storm, R. Catanescu, and J. Binder, “Comparison of stress measurement techniques in surface micromachining,” J. Micromech. Microeng., Vol. 7, pp. 151-154, 1997.
[14] M. Boutry, A. Bosseboeuf, J.P. Grandchamp, and G. Coffignal, “Finite-element method analysis of freestanding microrings for thin-film tensile strain measurement,” J. Micromech. Microeng., Vol. 7, pp. 280-284, 1997.
[15] M. J. Madou, “Fundamentals of microfabrication,” 2nd Edition, CRC Press, 2002.
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