本文目的為研究使用雷射於玻璃與矽晶的熔接問題。此問題是利用雷射在矽晶表面供應的熱源，造成矽晶表面熔解並達到與玻璃結合的目的。
理論分析方面，本文使用一組圓柱座標能量方程式同時描述玻璃與矽晶的熔接現象，其中，為了分析矽晶表面熱源和熔解的現象，引進潛熱和雷射熱源模型以單位體積熱源的型式加入能量方程式中。數值方法方面，引用積分法與體積分率法分別處理相變化過程中的物理性質不連續現象以及潛熱連續釋放現象，並且由積分法之特性，將玻璃與矽晶整合成單一計算區域，使得程式的撰寫更為方便。
結論方面，本文模擬的熔解半徑對應Tseng and Park [12-13] 實驗的熔解半徑是吻合的，模擬的熔解半徑為 。透過探討改變照射範圍以及照射時間對熔解半徑之影響，在固定入射能量以及不氣化的條件下，發現玻璃與矽晶的熔接過程擁有最佳的熔接範圍以及最佳的照射範圍與照射時間。

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