近年來，電子設備不斷在縮小化及高效能上精進，然而在元件縮小化且密集化的同時，亦增加了熱傳量。因此散熱需求也快速增加，所以促使電子散熱裝置日趨重要，進而發展許多不同形式散熱裝置。電子元件故障時，55%來自於溫度因素。現今的散熱方式越來越不適用於越做越小的電子產品，受限於空間、噪音和功率提供上的限制。
壓電風扇則是一個新的散熱概念設計，相當適用於筆記型電腦或是掌上型手機的散熱應用，相較於一般的散熱風扇而言，他有以下三個優點：體積小、消耗功率小、噪音小；換言之，這些優點相當適用於現在電子元件散熱的要求，需要低功率低噪音和不占空間的需求。而壓電風扇則是利用壓電材料具有壓電效應的特性來造成葉片的擺動，造成空氣紊流來散熱電子元件的溫度，本論文研究根據壓電材料之壓電參數d33、扇葉厚度和Bonding Glue之不同對壓電風扇的性能之影響與其對於鮨片散熱效果的做研究。

In recent years, the electronic equipment goes toward to little size and constantly improves on high efficiency. However, to microminiaturize and densify the electronic device / chip will lead to the result of increasing heat capacity transition. Therefore, the demand of heat dissipation increases fast, so it makes the electronic heat dissipation device become more important and furthermore develops a variety of functions/forms heat dissipation. Temperature is one of the reasons, taking 55% of them, to cause the electronic device damage. In nowadays, the technology of the heat dissipation is no longer suitable for small-size electronic products because of the limitation on size/volume, noise-reduction and power efficiency.
Piezoelectric fan is a new design about a concept of heat dissipation to be used in the heat dissipation application of notebooks or cell phones. Comparing with a traditional electric fan , there are three advantages: small volume, less power consumption and noise-reduction; In other words, these advantages are quite suitable for the demand of the electronic element in heat dissipation which requests low power, low noise and microminiature. Piezoelectric fan takes advantage of the characteristic of piezoelectric effect which will trigger the blade to turbulence the air for cooling down the heat/temperature of electric device. The research of this essay subjects to the materials of Piezoelectric fan--Piezoelectric parameter d33, the thickness of fan blade, the differential of Bonding Glue to effect piezoelectric performance, and the result of heat/thermal dissipation from pin fan.

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