本研究提出以CMOS MEMS技術為基礎，製作熱電式紅外線熱像儀之4×4焦面陣列，其感測結構具有Pixel面積小、填充率高、製程簡單等優點；並設計一數位訊號處理電路，依序傳送單一感測元件訊號，再將感測放大電路整合其中，以建立一完整的紅外線熱像儀之FPA系統。最後以tsmc 0.35 μm 2P4M標準製程及體型微加工後製程實現此系統，並建立實驗架構以量測晶片之感測訊號。

初步實驗結果發現On-chip 放大電路可將小訊號放大約618倍，適合用於本文之熱電式紅外線感測器；在數位訊號處理方面，利用類比開關做出類比訊號之多工器，由模擬結果發現，輸出訊號上雖有時脈變化之突波，但在類比開關ON時，小訊號可順利通過類比多工器。

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