本研究探討Sn/V、Sn/(Ni,V)及Sn-3.5%Ag/V、Sn-3.5Ag% /(Ni,V)在250°C下之界面反應。多數之無鉛銲料組成主要以Sn為主，而Sn-3.5%Ag又是目前最具潛力之無鉛銲料之一。近年來覆晶技術受到極大的重視，在銲料與UBM多層金屬間之界面反應更顯重要，而(Ni,V)合金則最常被用來作為UBM阻障層，以避免銲料直接與線路反應，造成電子元件通路失效。本研究之討論對於提供材料基礎性質之學術價值外，亦具有在業界應用上之價值。

純Sn與Sn-3.5wt%Ag在對(Ni,V)合金之界面反應結果上，大致相同，微量的Ag並不對界面反應有任何影響。當(Ni,V)合金之V含量在3wt%時，其生成相僅有一層溶有4at%之Ni3Sn4相，結果與Sn/Ni系統相似；當(Ni,V)合金之V含量增加至5wt%及7wt%時，則可觀察到Ni3Sn4與三元之界金屬相；當(Ni,V)合金之V含量增加至12wt%時，僅能觀察到一生成相，組成為Sn-5at%-25at%，其V含量明顯增加，在相圖上無法定義其生成相種類。利用以上之界面反應結果，建構出Sn-Ni-V三元系統之相圖，從Sn/Ni-5wt%V及Sn/Ni-7wt%V系統之生成相組成變動，推測在相圖中有一相三元之單相區。
Sn/V及Sn-3.5%Ag/V之界面反應結果，在低溫下純釩基材對銲料之濕潤性質不甚理想。由部分接著之試樣中發現， 在高溫950°C反應時間1小時，僅生成一V3Sn相。反應溫度在600°C時，只生成V2Sn3相。當反應溫度低至300°C時，則可觀察到V2Sn3及V3Sn相二相生成。

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