由於近年來光通訊產業的蓬勃發展，為了達到提升元件的性能與穩定性，並降低其製作成本、縮小元件體積等目的，積體化光電學元件所扮演的角色日益重要。本論文主要在是在探討在矽晶圓上設計雷射二極體與光波導對準耦合器(Aligning Coupler between Laser Diode and Optical Waveguide)，並藉此提升元件封裝時的對準容忍度以及耦合的效率。
我們利用目前最具知名度之一的BPM(Beam propagation method)光學模擬軟體來輔助元件的設計，元件的設計與模擬可分為三大部分：單模波導的尺寸最佳化設計、透鏡與光源距離最佳化以及錐形光波導耦合器結構之最佳化設計，藉此得到較高之耦合效率與對準容忍度。當我們找出最佳化的耦合條件後，便開始著手將元件製造出來，首先利用PECVD沉積薄膜，藉由調整製程氣體SiH4與N2O的流量來控制沉積薄膜的折射率製作波導的披覆層與導光層，並於其上蒸鍍一層Cr金屬層作為後續蝕刻製程的遮罩，接下來透過黃光微影製程定義出我們所設計的波導結構，藉由RIE乾式蝕刻將其實現出來。後續藉由SEM(Scanning electron microscope)來確認蝕刻後的元件結構，經確認其尺寸與形狀符合原始之設計後，接著便要嘗試將雷射二極體與我們所製作的耦合器進行封裝，量測分析實際情況與模擬結果做驗證。

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