本研究利用微機電系統製程技術於4吋之矽晶片上製作微流體系統中之重要元件壓電式微幫浦，並將其單一或並聯運轉測試分析其流率。探討驅動電壓對壓電薄膜形變之影響與驅動電壓、驅動頻率對微幫浦流率之影響。實驗結果顯示壓電材料之位移量介於2.7μm到20.47μm之間，並隨著施加之頻率增加而減小。輸入壓電材料之方波電壓為140V，頻率為20Hz時，單一幫浦產生最大流量為91 ，可承受最大背壓為400Pa。以相同輸入訊號驅動，做並聯運轉時發現，並聯幫浦可有效增加流率；雙並聯幫浦可增加1.5倍，三並聯幫浦增加為2倍。此外，以回歸方法分析微幫浦之實驗結果，建立驅動頻率壓電材料與微幫浦流率的關係，闡述實驗所觀察到的現象。

This study investigates the performance of the piezoelelctrically actuated micropump. The micropump is made by exposure, lithography, etching and bonding on 4 inch wafer.
The effects of driving voltage and frequency on the displacement of piezoelectric material and the flow rate of the micropump are investigated. The experimental results indicate that the displacement of the piezoelectric material decreases with frequency. The displacements of the piezoelectric material range from 2.7μm-20.47μm. The flow rate of the micropump is proportional to the applied voltage. When operated at the voltage of 140 V and the frequency of 20 Hz, the flow rate of the single micropump is about 91 µ1/min with the back pressure of 400Pa. At the same input signal, the maximum flow rate of the double parallel micropump is 1.5 times of the single micropump, and is approximately twice of the single micropump for triple parallel operation.
The relationship between frequency and flow rate obtained from measurement had been interpreted by physics principles and the derived mathematic regression method.

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