研究生: |
閔仲強 |
---|---|
論文名稱: |
以過濾式陰極電弧電漿系統合成氮化鋁薄膜結構及特性研究 Synthesis and characterization of the aluminum nitride thin film using the FCAP system |
指導教授: | 施漢章教授 |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 材料科學工程學系 Materials Science and Engineering |
論文出版年: | 2004 |
畢業學年度: | 92 |
語文別: | 中文 |
論文頁數: | 88 |
中文關鍵詞: | 過濾式陰極電弧 、氮化鋁 |
外文關鍵詞: | FCAP, AlN |
相關次數: | 點閱:1 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本論文利用過濾式陰極電弧沉積系統(Filtered Cathodic Arc Deposition System,FCAP)合成氮化鋁(aluminum nitride)薄膜,以作為高頻表面聲波元件與光學方面的應用。經由調整製程參數,如壓力、氣體比例、基板溫度及偏壓等參數,成功地合成氮化鋁薄膜的最佳參數。
實驗結果得知以本系統沉積氮化鋁薄膜其最佳製程條件為:基板溫度=500 ℃以上,壓力=1.8×10-3 Torr,N2 : Ar = 2 : 1時,所合成的氮化鋁薄膜,為多晶結構(polycrystalline structure)。當改變基板偏壓,AlN薄膜的結晶取向逐漸由(002)為主轉變為(100)為主;利用FTIR分析薄膜內之鍵結情況,結果顯示只有E1(TO)mode吸收峰,由其與理論值的差異和利用彎柄儀量測的結果進而得知薄膜承受壓應力。並利用AES及ESCA進一步探討AlN之化學成分之定性、定量分析;且能瞭解鋁元素及氮元素之鍵結能及化學位移量的變化;在AFM分析中得知所合成的氮化鋁薄膜平整度很好Rrms = 0.26 - 0.34 nm,且基板偏壓對其影響並不明顯;綜合上述結果,在基板偏壓-25V時,可得到最高的硬度值約為20.6 GPa。由光穿透光譜可發現,氮化鋁薄膜在可見光區擁有很高的穿透率,其能帶寬(band-gap energy)約為5.9 eV。
[1] W. M. Yim, E. J. Stofko, P. J. Zanzucchi, J. I. Pankove, M. Ettenberg, and S. L. Gilbert, J. Appl. Phys., Vol. 44, p292, 1973.
[2] S. Strite and H. Morkoc, J. Vac. Sci. Technol. B, Vol.10, p1237, 1992.
[3] Chang-Woo Nam, and Kyu-Chul Lee, IEEE Electronics and Electrotechnology.p206,2001.
[4] J. Meinschien, G. Behme, F. Falk, and H. Stafast, Applied Physics A69, S683, 1999.
[5] Marc-Alexandre Dubois and Paul Muralt, Appl. Phys. Lett, Vol.74, p3032, 1999.
[6] F. A. Ponce, J. S. Major, Jr, W. E. Plano, D. F. Welch, Appl. Phys.
Lett, Vol.65, p2302, 1994.
[7] Shigeo Yamaguchi, Yasuo Iwamura, Yasuhiro Watanabe, Masayoshi Kosaki, Yohei Yukawa, and Shugo Nitta et al., Appl. Phys. Lett, Vol.80, p802, 2002.
[8] T. P. Chow et al., Mat. Res. Soc. Symp. Proc , Vol.483, p89, 1998.
[9] Eliseo Ruiz, Santigo Alemany, Phys. Rev. B, Vol.49, p7115, 1994.
[10] JCPDS Card, NO.25-1133.
[11] Q. Xia et al., J. Appl. Phys., Vol.73, p8198, 1993.
[12] L. Liu and J. H. Edgar, Mat. Sci. Eng. R, Vol.37, p61, 2002.
[13] Ichiro Yonenaga, Toshiyuki Shima and Marcel H. F. Sluiter, Jpn. J. Appl. phys. part1, Vol.41, p4620, 2002
[14] H .Cheng, Y. Sun, J. X. Zhang, Y. B. Zhang, S. Yuan, P. Hing, J. Cryst. Growth, Vol.254, p46, 2003.
[15] D. Chandrasekhar et al., J. Cryst. Growth, Vol.152, p135, 1995.
[16] M. Morita et al.,Jpn. J. Appl. Phys., part1, Vol.20, p17, 1981.
[17] J. A. Kovacich et al., J. Appl. Phys., Vol.55, p2935, 1984.
[18] T. hiosaki et al., Appl. Phys. Lett., Vol.36, p643, 1980.
[19] M. Kasu and N. Kobayashi, Appl. Phys. Lett., Vol.79, p3642, 2001.
[20] Lu F, Carius R, Alam A, et al., J. Appl. Phys., Vol.92, p2457, 2002.
[21] Liu QL, Tanaka T, Hu JQ, et al., Appl. Phys. lett., Vol.83, p4939, 2003.
[22] Shibata, Tomohiko, Asai, Keiichiro, Nakamura, Yukinori, Tanaka, Mitsuhiro, Kaigawa, Kazuyuki; et Al., J. Cryst. Growth, Vol.229, p63, 2001.
[23] J. N. Kidder Jr. et al., J. Vac. Sci. Technol. A, Vol.13, p711, 1995.
[24] A. Dollet et al., Thin Solid Film, Vol.406, p1, 2002.
[25] G. Y. Meng et al., Thin Solid Film, Vol.334, p145, 1998
[26] K. Yasui et al., Appl. Surf. Sci., Vol.159-160, p462, 2000.
[27] S. A. Nikishin et al., Appl. Phys. Lett., Vol.75, p484, 1999.
[28] X. I. Ma et al., J. Mater. Res., Vol.14, p4685, 1999.
[29] J. Keckes et al., J. Cryst. Growth, Vol.240, p80, 2002.
[30] K. Seki et al., Appl. Phys. Lett., Vol.60, p2234, 1992.
[31] T. Ogawa et al., Appl. Surf. Sci., Vol.113/114, p57, 1997.
[32] R. D. Vispute et al., Appl. Phys. Lett., Vol.67, p1549, 1995.
[33] M. Ishihara, S. J. Li, H. Yumoto, K. Akashi, Y. Ide, Thin Solid Film, Vol.316, p152, 1998.
[34] Xiao-Hong Xu, Hai-shun Wu, Cong-Jie Zhang, Zhi-Hao Jin, Thin Solid Film, Vol.388, p62, 2001.
[35] Hao Cheng, Yong Sun, Peter Hing, Surf. Coat. Technol., Vol.166, p231, 2003.
[36] A. Sanz-Hervas, E. Iborra, M. Clement, J. Sangrador, M. Aguilar, Diamond and Related Materials, Vol.12, p1186, 2003.
[37] Hirofumi Takikawa, Naoya Kawakami, Tateki Sakakibara, Surf. Coat. Technol., Vol.120-121, p383, 1999.
[38] Hirofumi Takikawa, et al., Thin Solid Film, Vol.386, p276, 2001.
[39] S. J. Dixit, A. K. Rai, R.S. Bhattacharya, S. Guha, T. Wittberg, Thin Solid Film, Vol.398-399, p17, 2001.
[40] 賴冠仁,科儀新知,第十六卷五期,p83.
[41] A. E. Guile and B. Juttner, IEEE Trans. on Plasma Science PS-8(3), p259,1980.
[42] I. I. Aksenov, V. A. Belous, V. G. Padalka, V. M. Koroshhikh, Sov. J. plasma Phys. Vol.4, p425, 1978.
[43] E. Erturk, H.-J. Heuvel and H.-G. Dedrich, Surf. Coat. Technol., Vol.39, p455, 1989.
[44] H.-D. Steffens, M. Mack, K. Moehwald and K. Reichel, Surf. Coat. Technol., Vol.46, p65, 1991.
[45] J. S. Yoon, J. G. Han, Surf. Coat. Technol., Vol.94, p201, 1997.
[46] A. Anders, R. A. Macgill, Surf. Coat. Technol., Vol.133-134, p96, 2000.
[47] S. Anders, A. Anders, M. R. Dickenson, R. Macgill, and I. G. Brown, IEEE. Trans. Plasma Sci., Vol.25, p670, 1997.
[48] 汪建民,材料分析,中國材料科學學會,1998.
[49] 謝志德,國立清華大學材料科學工程學系碩士論文,2001.
[50] Kenji Hinode and Yoshio Homma, J. Vac. Sci. Technol. A, Vol.14, p2570, 1996.
[51] 黃思嘉,國立清華大學材料科學工程學系碩士論文,2003.
[52] Hsyi-En Cheng, Tien-chai Lin, Wen-chien Chen, Thin Solid Film, Vol.425, p85, 2003.
[53] W. Osterle, I. Dorfel, I. Urban, T. Reier, J. W. Schultze, Surf. Coat. Technol., Vol.102, p168, 1998.
[54] A. Mahmood, R. Machorro, S. Muhl, J. Heiras, F. F. Castillon, M. H. Farias, E. Andrade, Diamond and Related Materials, Vol.12, p1315, 2003.
[55] B. Wang, Y. N. Zhao, and Z. He, Vacuum, Vol.48, p427, 1997.
[56] M. Clement, E. Iborra, J. Sangrador, A. Sanz-Hervas, L. Vergara, and M. Aguilar, J. Appl. Phys., Vol. 94, p1495, 2003.
[57] C. Carlone, K. M. Lakin, and H.R. Shanks, J. Appl. Phys., Vol. 55, p4010, 1984.
[58] Si-Hyung Lee, Ki Hyun Yoon, Deok-Soo Cheong, Jeon-Kook Lee, Thin Solid Film, Vol.435, p193, 2003.