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研究生: 張明仁
Chang, Ming-Jen
論文名稱: 金氧半電容式微型環狀電光調變器製程開發
Fabrication of MOS capacitor micro-ring eletro-optic modulator
指導教授: 趙煦
Chao, Shiuh
口試委員:
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 光電工程研究所
Institute of Photonics Technologies
論文出版年: 2009
畢業學年度: 97
語文別: 中文
論文頁數: 95
中文關鍵詞: 光學微型環狀共振腔電光調變器線邊粗糙度
外文關鍵詞: Line-edge roughness, LER, CMP, Optical Modulator, SPC
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  • 此論文以本實驗室發表於Journal of Lightwave Technology之“Design and Analysis of MOS-capacitor Microring Optical Modulator with SPC Poly-silicon Gate"[9]文章為基礎,為將金氧半電容式光學微型環狀共振腔電光調變器之設計概念實現,進行金氧半電容式光學微型環狀共振腔製程開發及優化。此元件製作在SOI晶片上,幾何尺寸,脊形高度(rib height) 0.78um、肩膀高度(slab height)0.36um、寬度(rib width)為1um的脊狀波導(rib waveguide) 結構由上到下為:厚度0.568um,P型,濃度是3×1018cm-3的多晶矽(以SPC方式結晶)閘極、厚度為12nm的閘極氧化層和高度0.1um,N型,濃度為3×1017cm-3的單晶矽。製程重點包含微影與蝕刻製程兩大部分:微影部分共10道光罩(含零層),以電子束系統定義最小線寬100nm的光耦合區域、波導佈局,並且致力改善電子束微影製程,優化光阻的線邊粗糙度(Line-edge roughness , LER),提升波導的光學特性。其餘後續製程以I-line光學步進機定義光阻圖案,在環狀共振腔建立主動式電光開關。蝕刻部分著眼於脊狀波導的蝕刻深度及形狀,以及使用化學機械研磨(CMP)系統讓晶片平坦化。


    第一章 導論 1.1 研究動機……………………………………….…......…………1 1.2 基本介紹…………………………………………………………….3 第二章 製程設備介紹 2.1微影製程儀器介紹 2.1.1 I-line光學步進機……………………..………………………5 (Canon FPA-3000i5+ I-line stepper) 2.1.2 Variable-shape beam電子束直寫系統………………….……5 (LEICA WEPRINT 200 E-Beam stepper) 2.1.3 Gaussian beam電子束直寫系統………………………..………7 (ELIONIX ELS-7500EX E-beam writer) 2.1.4 自動化光阻塗佈及顯影系統……………………………..……8 (TEL CLEAN TRACK MK-8) 2.2蝕刻製程儀器介紹 2.2.1多晶矽薄膜乾式蝕刻機 (Lam TCP9400 Poly Etcher)…..…10 2.2.2氧化矽薄膜乾式蝕刻機 (TEL TE5000 Oxide Etcher) ……12 2.2.3乾式光阻薄膜去除機 (Mattson Ozone Asher) …………13 2.2.4金屬薄膜乾式蝕刻機 (Lam TCP9600 metal etcher) ……14 2.2.5化學機械研磨系統 (IPEC Westech system 372M)……16 2.3薄膜製程儀器介紹 2.3.1化學氣相沉積系統 2.3.1.1低壓、常壓化學氣相沉積系統………………………………19 (SVCS Furnace system) 2.3.1.2 電漿輔助化學氣相沉積系統……………………….………20 (Oxford InstrumentPlasma Technology limited PECVD system) 2.3.2薄膜測厚儀(n&k nk1500 analyser)…………………….………21 第三章 製程內容 3.1元件尺寸介紹………………………………………………………………22 3.2 製程………………………………………………………………………...25 3.2.1製程步驟 (1)晶片備製…………………………………………..26 1-1晶片削薄 1-2 N型基板佈植 (2)光波導結構之形成 ………………….…..………..27 2-1 MOS結構薄膜沉積 2-2 脊狀光波導之蝕刻 2-3 介電質填充 2-4 晶片表面平坦化 (3)主動式電光開關之連接…………………………..32 3-1 閘極的摻雜與形狀定義 3-2 源、汲極的摻雜與形狀定義 3-3 閘極的金屬連接 3-4 源、汲極的金屬連接 3.2.2光罩介紹及實際曝光後的SEM照片………………………………39 3.3製程細部探討 3.3.1微影部分 3.3.1.1曝光機無法辨別對準記號(Alignment mark)的現象及解決方式………………………………………………………..…52 3.3.1.2 LEICA WEPRINT 200電子束直寫系統(Variable-shape E-beam)曝光的鄰近效應(Proximity effect)現象及解決方式…………………………………………………………..…53 3.3.1.3 LEICA WEPRINT 200電子束直寫系統(Variable-shape E-beam)的曝光效果及優化……………….……….………56 3.3.1.4 LEICA WEPRINT 200電子束直寫系統(Variable-shape E-beam)與ELIONIX ELS-7500EX電子束直寫系統(Gaussian E-beam writer)合併使用的作法………………….…………59 3.3.2蝕刻部分 3.3.2.1波導頂部崩塌現象及解決方式…………………………..…61 3.3.2.2以濕式蝕刻去除TEOS hard mask的風險及解決方式…….63 3.3.2.3 TCP9400乾式蝕刻能達到的極限間隙寬度……………..…65 3.3.3金屬與金屬連接 3.3.3.1第一層金屬與第二層金屬連接前的處理……………..……67 3.4元件成品的OM及SEM照片……………………………………..………68 第四章 未來展望……………………………………………………………………71 第五章 參考文獻……………………………………………………………………73 附錄一 SOI規格表…………………………………………………………….……76 附件二 Run card(步驟及製程條件參數) ………………………………………..…77 附錄三 常見的nk1500表面反射光譜……………………………………..………88 附錄四 Gaussian E-beam與 Variable-shape E-beam曝光效果比較………....……91

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