在電子構裝散熱中，為了降低散熱模組與發熱源的表面接觸熱阻，故需要使用熱介面材料(Thermal Interface Material, T.I.M.)把CPU所產生的高熱有效的帶走已達到散熱的目的。本論文主要目的為以實驗方法去討論不同粒徑的鋁粉尺寸與不同的高分子材料去搭配，藉此找出最適合的材料與配方去製作高熱傳導係數之導熱膏，同時在實際應用上能有效的降低系統熱阻。
本論文實驗分為三大部分：第一部分為TIM 量測平台的穩定性分析，第二部份為鋁粉填充比率對熱傳導係數實驗分析，第三部份為聚乙二醇(Polyethylene Glycols，PEG-400)對熱傳導係數的影響。
　　由實驗結果可以發現，改良後之T.I.M.量測平台所量測出道康寧TC-5121熱傳導係數重複性與再現性相對誤差都在1%以下；信越7762熱傳導係數重複性相對誤差都在5%以下而再現性相對誤差都在3%以下，故本量測平台具有良好的穩定性與準確性；由鋁粉填充比率對熱傳導係數實驗結果可知，導熱膏的熱傳導係數會隨著鋁粉重量百分比的增加而提升，大約在78~80 Wt% 左右為導熱膏填充比率之極限也有最高的熱傳導係數；由聚乙二醇對熱傳導係數的影響實驗結果可知，不論在single-mode或bi-mode的堆疊方式，聚乙二醇可發揮其bonding之能力有助於形成有效的熱傳途徑並提高導熱膏的熱傳導係數而使用聚乙二醇與低黏度矽油(250 cs.)以適當的比例作撘配後當作導熱膏載體，有助於降低系統熱阻。

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