近年來無光罩的微結構成型技術逐漸開始受到重視，相較於現今微結構技術中最廣泛使用的光微影技術，不但省去光罩的定義與製作過程，也避免光阻以及真空設備的使用，大幅降低了成本。在本實驗室先前的研究中，經由氧化亞鐵硫桿菌代謝溶液蝕刻金屬銅表面，以形成帶有銅離子的溶液，再藉由1064 nm波長的摻釹釔鋁石榴石雷射聚焦於銅試片上，以X-Y線性滑軌平台引導雷射路徑並輔助銅離子沉積。此金屬微結構直接成型技術結合天然蝕刻液以及雷射引導沉積兩種特性，並發現金屬銅沉積量與雷射功率、掃描速度之倒數及掃描次數間存在著正相關性。本論文則嘗試將銅基板更換為其他常見非導體材料，如PI薄膜、矽基板與二氧化矽基板，以擴大應用性，並使用波長532nm雷射光源，探討不同波長對此技術之影響與比較。
二氧化矽基板相較於其他基板材料可得到較好沉積線表現，並發現其成分將因更換基板而造成影響，而原因為蝕刻時間長短以及蝕刻過程所產生之沉積物。雷射光源的更換發現在同樣的沉積量下，波長532nm雷射將比波長1064nm雷射需要更少的單位能量，並得到較好的沉積線結果。

In recent years, intensive efforts in the development of direct metallization techniques for micro-fabrication have taken place as a result of the convergence of different fields of science and technology. A mask-less fabrication process has been developed on the other hand. The designed micro patterns are written on the specimen by laser guiding to build or repair micro structure rapidly rather than using the mask fabrication process requiring long lead time. We have studied the feasibility of laser-assisted copper deposition on copper substrate using Thiobacillus ferroxidants metabolite as working medium with a 1064nm Nd:YAG laser to form desired patterns, and found there is a positive correlation between the deposition amount and the laser power, scan repetitions and reciprocal of scanning speed, respectively. To expand the application, substrate replacement is in need. The choice of the substrate is mainly determined by the application domain and includes polyimide, Si and SiO2. 532nm laser source is set up to find the effect of wavelength on the deposition lines.
Compare to other substrates, SiO2 showed better performance of deposition continuity. After changing the substrate, both etching time and sediment from etching reaction would affect the composition of the deposition line. Moreover, there were less energy consumption and better deposition results by changing laser source from 1064nm to 532nm.

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