微機電系統(MEMS)包含微機械結構、微感測器與微致動器三大領域。由於微機械加工製造技術不斷地進步，使得各領域的發展漸趨成熟。然而微機械加工技術根源於積體電路的平面製程技術，所製作出來的元件皆以二維的方式展現，在許多應用上間接受到了限制。本研究主要探討如何利用半導體製程的方式，配合自組裝機制的設計，來製作出具高定位精度及陣列式組裝能力的三維微結構。並藉此建立以單層多晶矽作為結構層的製作流程，提供另一種製程設計的選擇。

Microelectromechanical system (MEMS) contains microsensors, microactuators, micromechanical structures, and integrated circuits. Since the micromachining fabrication processes are improved drastically, plenty of micromachined devices have been developed and commercialized presently. However the applications of these devices are still limited by traditional IC planar fabrication process. Three-dimensional devices are needed to contact, react, or communicate with the real world.
This research intends to develop a novel self-assembly three-dimensional microstructure. Combine with microactuators, positioning grooves, and microbridges to satisfy the demands of high precision and array-type assemble simultaneously. From the study, the technology of design, analysis, fabrication, and measurement of an out-of-plane micromirror with a special angle are established.

[1] T. Ebefors, E. Kalvesten, and G. Stemme, "Three dimensional silicon triple-hot wire anemometer based on polyimide joints," Proceeding of the IEEE MEMS'98 Workshop, Heidelberg, Germany, 1998, pp. 93-98.
[2] L. Y. Lin, S. S. Lee, K. S. J. Pister, and M. C. Wu, "Three-dimensional micro-Fresnel optical elements fabricated by micromachining technique," Electronics Letters, vol. 30, pp. 448-449, 1994.
[3] R. S. Muller, and K. Y. Lau, "Surface-micromachined microoptical elements and systems," Proceedings of the IEEE, vol. 86, no. 8, pp. 1705-1720, 1998.
[4] M. H. Kiang, O. Solgaard, K. Y. Lau, and R. S. Muller, "Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning," Journal of Microelectromechanical Systems, vol. 7, no. 1, pp. 27-37, 1998.
[5] T. Ebefors, E. Kalvesten, and G. Stemme, "New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures," Journal of Micromechanics and Microengineering, vol. 8, pp. 188-194, 1998.
[6] R. Yeh, E. J. J. Kruglick, and K. S. J. Pister, "Surface-micromachined components for articulated microrobots," Journal of Microelectromechanical Systems, vol. 5, pp. 10-17, 1996.
[7] L. Fan, R. T. Chen, A. Nespola, and M. C. Wu, "Universal MEMS platforms for passive RF components : suspended inductors and variable capacitors," Proceeding of the IEEE MEMS'98 Workshop, Heidelberg, Germany, 1998, pp. 29-33.
[8] G. O'Brien, D. J. Monk, and L. Lin, "MEMS flip-up micro-coil inductors," Micro-Electro-Mechanical Systems (MEMS)-2000, Oriando, Florida, 2000, pp. 349-353.
[9] L. Y. Lin, J. L. Shen, S. S. Lee, and M. C. Wu, "Surface-micromachined micro-xyz stages for free-space microoptical bench," IEEE Photonics Technology Letters, vol. 9, no. 3, pp. 345-347, 1997.
[10] S. Reyntjens, and R.Puers, "Focused ion beam induced deposition: fabrication of three-dimensional microstructures and Young's modulus of the deposited material," Journal of Micromechanics and Microengineering, vol.10, pp. 181-188, 2000.
[11] K. S. J. Pister, M. W. Judy, S.R. Burgett, and R. S. Fearing, "Microfabricated hinges," Sensors and Actuators A, vol. 33, pp. 249-256, 1992.
[12] M. C. Wu, "Micromachining for optical and optoelectronic systems," Proceedings of the IEEE, vol. 85, no. 11, pp. 1833-1856, 1997.
[13] L. Y. Lin, S. S. Lee, K. S. J. Pister, and M. C. Wu, "Micro-machined three-dimensional micro-optics for integrated free-space optical system," IEEE Photonics Technology Letters, vol. 6, no. 12, pp. 1445-1447, 1994.
[14] K. Suzuki, I. Shimoyama, H. Miura, and Y. Ezura, "Creation of an insect-based microbot with an external skeleton and elastic joints," Proceeding of the IEEE MEMS'92 Workshop, Travemunde, Germany, February 4-7, 1992, pp. 190-195.
[15] E. Hoffman, B. Warneke, E. Kryglick, J. Weigold, and K. S. J. Pister, ?D structures with piezoresistive sensors in standard COMS," Proceeding of the IEEE MEMS'95 Workshop, Amsterdam, Neth, Jan 29-Feb 2, 1995, pp. 288-293.
[16] T.G. Barnes, T. Q. Truong, X. Lu, N. E. McGruer, and G. G. Adams, "Design, analysis, fabrication and testing of a MEMS flow sensor," Proceeding of the IEEE MEMS'99 Workshop, Nashville, Tennessee, November 14-19, 1999, pp. 355-361.
[17] G. Lin, C. J. Kim, S. Konishi, and H. Fujita, "Design, fabrication and testing of a C-shape actuator," The 8th International Conference on Solid-State Sensors and Actuators(Transducers'95), Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp.416-419.
[18] S. Schweizer, S. Calmes, M. Laudon, and Ph. Renaud, "Thermally actuated optical microscanner with large angle and low consumption," Sensors and Actuators A, vol. 76, pp. 470-477, 1999.
[19] G. Lammel, and P. Renaud, "Free-standing, mobile 3D porous silicon microstructures," The 13th European Conference on Solid-State Transducers(Eurosensors XIII), Hague, Netherlands, September 12-15, 1999, pp. 1033-1036.
[20] P. W. Green, R. R. A. Syms, and E. M. Yeatman, "Demonstration of three-dimensional microstructure self-assembly," Journal of Microelectromechanical Systems, vol. 4, No. 4, pp. 170-176, 1995.
[21] R. R. A. Syms, "Equilibrum of hinged and hingeless structures rotated using surface tension forces," Journal of Microelectromechanical Systems, vol. 4, no. 4, pp. 177-184, 1995.
[22] P. E. Kladitis, K. F. Harsh, V. M. Bright, and Y. C. Lee, "Three-dimensional modeling of solder shape for the design of solder self-assembled micro-electro-mechanical systems," Proceeding of the IEEE MEMS'99 Workshop, Nashville, Tennessee, November 14-19, 1999, pp. 11-18.
[23] R. R. A. Syms, "Rotational self-assembly of complex microstructures by the surface tension of glass" Sensors and Actuators A, vol. 65, pp. 238-243, 1998.
[24] T. Ebefors, E. Kalvesten, C. Vieider, and G. Stemme, "New robust small radius joints based on thermal shrinkage of polyimide in V-grooves," 1997 International Conference on Solid-State Sensors and Actuators(Transducers'97), Chicago, June 16-19, 1997, pp. 675-678.
[25] E. J. Garcia, "Micro-flex mirror and instability actuation technique," Proceeding of the IEEE MEMS'98 Workshop, Heidelberg, Germany, 1998, pp. 470-475.
[26] Y. Fukuta, T. Akiyama, and H. Fujita, "A reshaping technology with joule heat for three dimensional silicon structures," The 8th International Conference on Solid-State Sensors and Actuators(Transducers'95), Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp. 174-177.
[27] T. Akiyama, D. Collard, and H. Fujita, "Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMS," Journal of Microelectromechanical Systems, vol. 6, no. 1, pp. 10-17, 1997.
[28] E. Smela, O. Inganas, and I. Lundstrom, "Controlled folding of micrometer-size structures," Science, vol. 268, pp. 1735-1738, 1995.
[29] S. Takeuchi, and I. Shimoyama, "A three-dimensional shape memory alloy microelectrode with clipping structure for insect neural recording," Journal of Microelectromechanical Systems, vol. 9, no. 1, pp. 24-31, 2000.
[30] T. Akiyama, and K. Shono, "Controlled stepwise motion in polysilicon microstructures," Journal of Microelectromechanical Systems, vol. 2, no. 3, pp. 106-110, 1993.
[31] R. J. Linderman, and V. M. Bright, "Optimized scratch drive actuator for tethered nanometer positioning of chip-sized components," Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 4-8, 2000, pp. 214-217.
[32] K. E. Petersen, "Dynamic micromechanics on silicon: techniques and devices," IEEE Transactions on Electron Devices, vol. ED-25, no. 10, pp. 1241-1250, 1978.
[33] R. B. Hopkins, "Design analysis of shafts and beams," New York, McGraw-Hill, 1970.
[34] W. Fang, and J. A. Wickert, "Post-buckling of micromachined beams," Proceeding of the IEEE MEMS'94 Workshop, Oiso, Japan, 1994, pp. 182-187.