Although the technology of medical apparatus has advanced, the real-time monitoring patient for health conditions requires more progress. The real-time monitoring device can not only promote user’s awareness but also prevent disease, control chronic disease, and help provide correct diagnosis. This concept can be realized by integrating microsensors and microactuators on bio-compatible flexible substrates. A development of electrical routing and integrated package on bio-compatible flexible substrates has been designed and fabricated. Polyimide is used as flexible substrate to make electrical circuit and PDMS is used as protective layer to seal the whole device. The electrical connection between chip and circuit is connected by wire bond or flip chip technology. The realized packaging method can integrate electrical circuit, motionless components and movable components on flexible substrates. Chips can be embedded into flexible package and work on non-planar surface. The most characteristic advantage is that movable components, such as MEMS mirror, can be packaged and function inside the package by using the cover. This packaging method can provide good sealing ability, good tensile strength and good flexibility. It can easily attach to human skin and the strength of the package is well. This flexible packaging technology can be applied to communication or sensing technology when flexibility is required. The mechanical properties of PDMS are also realized in this study. Larger ratio of curing agent, higher curing temperature and longer heating duration can cause larger value of Young’s modulus. Besides, the density of PDMS is barely affected by the ratio of curing agent.

僅管健康醫療的科技不斷推陳出新，至今卻甚少可提供即時偵測患者健康狀況的醫療設備。因此，本研究從事穿戴式即時健康監測系統，能夠隨時了解身體狀況，還可以輔助使用者及早預防疾病、監督慢性病、追蹤健康狀況，並立即提供正確的醫學診斷。此概念可藉由將微感測器與微制動器整合於生物相容之撓性基材上來達成。生物相容撓性基材上導線製程與元件整合構裝技術在本研究中成功地設計與實現。本研究利用聚醯亞胺(polyimide)當作撓性基材製作電路，利用打線或覆晶接合技術將晶片與基材上導線連接，並利用聚二甲基矽氧烷(PDMS)當作保護層將晶片密封。此封裝方式可將電路、靜態元件和動態元件成功整合在撓性基材上，使其能夠在非平面上工作。此封裝技術最大的特色就是利用封蓋將微鏡面等動態元件成功封裝，使其能在封裝體內活動。經過測試，此封裝方式擁有良好的氣密性、抗拉性和撓性，能夠輕易緊貼於人體皮膚上並提供適當強度。在應用方面，此撓性封裝技術可使用在需要撓性條件之傳輸或感測設備上。本篇論文也對聚二甲基矽氧烷的機械性質做一研究，其楊氏模數實驗結果為固化劑比例越高、固化溫度越高、加熱時間越長，聚二甲基矽氧烷的楊氏模數值就會越大，反之則越小。在密度方面則是幾乎不受固化劑比例的影響。

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