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研究生： 徐偉翔
Hsu, Wei-Hsiang
論文名稱： 考慮溫度限制下多核處理器之效能最佳化
Throughput Optimization for Thermally Constrained Multi-Core Processors
指導教授： 張世杰
Chang, Shih-Chieh
口試委員:
學位類別： 碩士
Master
系所名稱： 電機資訊學院 - 資訊工程學系
Computer Science
論文出版年： 2009
畢業學年度： 97
語文別： 英文
論文頁數： 40
中文關鍵詞： 多核心處理器 、溫度限制 、效能最佳化
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    • 隨著製程的進步，微電路設計中的電功耗密度會逐年增加，而電功耗密度的增加也會造成溫度的上升；為了避免溫度過高所造成的嚴重影響，在晶片設計時必須要有溫度上的限制。多核心處理器是現今常被用來增加晶片效能的架構；晶片效能可以被表示成每個核心的速度乘上權重後的加總，核心的速度愈快，效能會愈好；另一方面，從讓晶片滿足溫度限制的的角度來看，核心速度是愈慢愈好，效能最佳化就是定義成去決定每個核心的速度，讓晶片效能最好並且滿足溫度的限制。我們提出了一個效能最佳化方法，這個方法的時間複雜度是線性的，而且效能的增進比起之前研究還要好4.01%。

    Abstract 3 List of Contents: 4 List of Figures: 5 List of Tables: 6 Chapter 1 Introduction 7 Chapter 2 System-Level Thermal and Power Models 12 2.1. Thermal Model 14 2.2. Power Model 17 2.2.1. Dynamic Power Model 17 2.2.2. Leakage Power Model 17 Chapter 3 Problem Formulation 20 Chapter 4 Methodology 22 4.1. Problem of the Previous Work 23 4.2. Effective Throughput Optimization Algorithm 25 4.3. Minor Modification of the Previous Work 31 Chapter 5 Experimental Results 32 5.1. Experimental Flow 32 5.2. Experimental Results 34 Chapter 6 Conclusions 36 References 37

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    [9]. W. Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, M. R. Stan, “HotSpot: A compact thermal modeling methodology for early-stage VLSI design,” IEEE Trans. Very Large Scale Integration Systems, vol. 14, no. 5, pp. 501-513, May 2006.
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