在本研究主要是以理論分析探討覆晶封裝中，點膠式縫隙填膠製程( Dispensing Process for Flip Chip Underfill)的充填過程；此外並考慮熱固性封裝材料的化學流變特性，針對溫度、轉化率作一詳細的探討。利用建立在三維流動的共位體心有限體積法（Collocated Cell- Centered Finite Volume Method）計算在封裝過程中的流場分佈，並配合求解體積分率方程式的自由面計算方法來預測波前的形狀及位置；針對表面張力的處理，則是導入連續表面張力模式（CSF Model），黏度模式則是採用Castro-Macosko模式，以考慮轉化率與剪切率的影響。
由於在覆晶中，錫球之間的間距與晶片和基板之間的間距差異不大，所以傳統常用的Hele-Shaw流動近似理論並不適用。本研究則是利用三維的分析技術來模擬整個封裝的流動，並進一步探討溫度、點膠方式與錫球對於充填流場的影響。

In this paper, the dispensing process for flip chip underfill is discussed by theoretical analysis. Above all the simulation results have considered the properties of chemorheology for the thermosetting polymer, especially the effect of temperature and conversion. Using the collocated cell-centered finite volume method based on three-dimensional calculates the flow field during underfilling process, and predicts the shape and movement of the melt front with time with the method of computation of free surface which solves the volume fraction equation. In regard to the calculation of surface tension, we use continuum surface force (CSF) model. Castro-Macosko Model which considers the effect of conversion and shear rate is induced for providing a described of the resin viscosity change.
Because the gap between bumps is slightly larger or smaller than the gap between chip and substrate, Hele-Shaw approximation is not suitable. In the work, we simulation the flow during underfilling process by using the three-dimensional technology and study the effect of temperature , dispensing pattern and bumps on the process further.

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